Nondestructive Testing Industry Review 2002

SUMMARY

The nondestructive testing (NDT) industry continues to change. The core NDT technologies are evolving in important ways and the applications inwhich NDT is used are also changing rapidly. Many of the industries that have traditionally used NDT techniques continue to stagnate or decline, whileother industries that have only recently begun to use NDT techniques are expanding. In addition, a wave of consolidations and mergers is stillaffecting the NDT industry.

The radiographic NDT technique in particular has seen a rebirth, and is being used in areas that are not in the traditional NDT market, such asExplosive Detection Systems (EDS) used for airport and maritime security in our nation's port of entries. A variety of traditional NDT techniques arealso being used in the semiconductor wafer industry for metrology of ever decreasing feature sizes of integrated chips (Ics).

The final effects of all these changes have yet to be felt. Understanding the possible implications and effects of these changes will be key tosuccess in the NDT industry in the new millennium. This review attempts to identify the major industry movements and trends and to serve as a guidefor suppliers, manufacturers, and users of NDT techniques. Readers of this review will not only understand where the NDT industry is now, but alsowhere it is heading.

This review is one of the few to detail new, emerging NDT technologies in the context of the overall nondestructive testing market. This review givesreaders an opportunity to learn about extremely up-to-date, cutting-edge technologies. In addition, the latest business developments and companychanges have been included in this publication, giving readers an up-to-the-minute perspective on the market.

As a manager or administrator of nondestructive testing, you will be kept up to date on developments in:

• Ultrasonics
• Infrared
• Software
• Radiology
• Acoustics
• Optical
• Eddy currents
• Standards
• Regulations

TABLE OF CONTENTS

INTRODUCTION/SUMMARY

• BCC ON-LINE SERVICES
  • INTERNET

ACOUSTICS

• WIDE BANDWIDTH AMPLIFIER SYSTEMS
• HIGH-SPEED AE SYSTEM
  • HIGH-SPEED AE SYSTEM (CONTINUED)

AWARDS

• KEITHLEY CITED FOR THERMOMETRY RESEARCH
• KEITHLEY BAGS R&D 100 AWARD

DATA ACQUISITION

• DYNAMIC PRESSURE TRANSDUCER
• DC AND RF MEASUREMENTS
• OPTICAL SWITCH CARD INTROS
• ROBUST PCI DIGITAL I/O CARDS
• DC/RF/OPTICAL HYBRID SWITCHES
• SPATIAL RAM GETS THE DATA
• ETHERNET-BASED DMM/DATA SYSTEM
• HIGH-PERFORMANCE VISION PROCESSOR
• TWENTY-CHANNEL SWITCHING MODULES
  • TWENTY-CHANNEL SWITCHING MODULES (CONTINUED)

EDDY CURRENT

• MULTISCAN MS 5800
• HANDHELD NDT INSTRUMENTS
• COMPACT WHEEL INSPECTION UNIT
• TUBE INSPECTION IN NUCLEAR GENERATORS
• SIX-INCH METAL-LOSS XYZ MAPPING TOOL

ELECTROMAGNETICS

• LEVEL MEASUREMENT EVEN THROUGH DUST
• TERAHERTZ IMAGING OF BIOLOGICALS
• THICKNESS CONTROL OF SILICON WAFERS
• POINT LEVEL RF SWITCH
• MOTION FAILURE ALARM DEBUTS
• PIPE-LOCATING SENSOR PREVENTS LEAKS
• REMOTE MONITORING OF INVENTORY
  • REMOTE MONITORING OF INVENTORY (CONTINUED)
• NO CALIBRATION MEASUREMENT DEVICES
• LEVEL MEASUREMENT IN CRITICAL CONDITIONS

INDUSTRY NEWS

• AMETEK ACQUIRES PERKINELMER'S IRAS
• ELVAL USES COGNEX SYSTEM
• AS&E SETTLES PATENT INFRINGEMENT CASE
• ELBIT SALES GAIN IN NORTH AMERICA
• FEI OPENS ON NASDAQ
• FLIR COMPLETES STOCK OFFER
• USN BUYS INVISION EDS
• FAA PURCHASES INVISION CTX SYSTEM
• SICK ACQUIRES RVSI'S I.D. DIVISION
• ZYGO SELLS AUTOMATION GROUP
• REEVALUATION OF AIRCRAFT CABIN AIR RECOMMENDED
  • REEVALUATION OF AIRCRAFT CABIN AIR RECOMMENDED (CONTINUED)
• COGNEX WINS APPEAL IN SUIT
• ELBIT SELLS TIRE-CORD SYSTEM
• FRENCH ORDER INVISION EDS
• ATMEL ADOPTS KLA SOFTWARE
  • ATMEL ADOPTS KLA SOFTWARE (CONTINUED)
• 3D INSPECTION SYSTEMS SOLD
• DEVICE INSPECTION AND TAPING SYSTEM
• VEECO RECEIVES MULTIPLE ORDERS
• VEECO AND PHOTRONICS FORM PARTNERSHIP
• EPRI FORMS INTERNATIONAL UNIT
• CORRPRO MOVES TO AMEX
• ADE'S NANOMAPPER WINS A DEAL
• FEI RECEIVES IC3D SYSTEM ORDER
• FEI APPOINTS NEW CTO
• QUANTUM TESTIFIES BEFORE SUBCOMMITTEE
• INVISION RECEIVES MULTIPLE ORDERS
• JMAR RECEIVES DARPA AWARD
  • JMAR RECEIVES DARPA AWARD (CONTINUED)
  • JMAR RECEIVES DARPA AWARD (CONTINUED)
• AGFA CONSOLIDATES X-RAY FACILITIES
• ADE DELIVERS INSPECTION TOOL
• COGNEX SENSORS FOR ROBOT GUIDANCE
• PRESIDENT CALLS FOR ADVANCED INSPECTION
• FLIR SIGNS CREDIT AGREEMENT
• INVISION BAGS BIG TSA ORDER
• INVISION, COORSTEK LOOK TO PARTNERING
• PPT MAKES A SALE
• GPS MANUFACTURER TO USE RVSI
• VEECO AGREES WITH EPION
• COGNEX ENTERS OEM AGREEMENT
• COGNEX CHOSEN BY STEELMAKER
• TECHNOLOGY SOLUTIONS FOR SECURITY
• INVISION COMMENTS ON DOT SCREENING PLAN
• INVISION GETS INTERNATIONAL ORDERS
• INVISION WINS TSA ORDER
• KEITHLEY OPENS TOKYO OFFICE
• KLA-TENCOR'S KLARITY SOFTWARE CHOSEN
• THERMO ELECTRON ACQUIRES CRS ROBOTICS
• DETECTOR SNIFFS OUT EXPLOSIVES
• LLOYD'S REGISTER APPROVES MILLTRONICS
• POLAROID FILES REORGANIZATION PLAN
• 3D INSPECTION SYSTEMS SALE
• RVSI DISCLOSES SEC INVESTIGATION
• EPRI REPORTS AVAILABLE ONLINE
• AS&E RECEIVES DOD PURCHASE AGREEMENT
• AS&E PRESENTS AT SECURITY SYMPOSIUM
• FLIR AWARDED $7.3M CONTRACT
• FLIR COMMENTS ON SEC RECOMMENDATION
• FLIR APPOINTS NEW OUTSIDE AUDITOR
• INVISION GETS ORDERS FROM FRANCE
• QUANTUM DEMOS WEAPONS DETECTION
• JMAR RECEIVES XRL ORDER
• KEITHLEY PROGRAM HELPS OEMS
• RVSI GETS WAFER INSPECTION ORDER
• RVSI GETS $1.4M ORDER
• CORRPRO STILL UNDER INVESTIGATION
• ADE NAMES NEW CEO
• COGNEX IN DEAL WITH ACCU-SORT
• AS&E RECEIVES GOVERNMENT ORDER
• FEI INSTALLATION AT SILICON LABORATORIES
• FLIR AWARDED $5.7M CONTRACT
• INVISION GETS $6.6M ORDERS
  • INVISION GETS $6.6M ORDERS (CONTINUED)
• JMAR WINS LITHOGRAPHY ORDER
• THERMO-ELECTRON TO ACQUIRE SAINT-GOBAIN
• BOEING-SIEMENS TEAM WINS AIRPORT CONTRACT
• ADE PRODUCT BAGS R&D AWARD
• COGNEX CHOSEN BY STEEL PRODUCER
• COGNEX ANNOUNCES WORKFORCE REDUCTION
• COGNEX SUES MATROX
• GOVERNMENT ORDERS AS&E SYSTEMS
• DOD ORDERS MOBILESEARCH
• VEECO FEI TO MERGE
• MEXICAN NAVY GETS FLIR SYSTEM
• INVISION WINS MULTIPLE ORDERS
• PHILIPS TO SELL X-RAY BUSINESS
• SIMETRA FTP WINS R&D 100 AWARD
• DUTCH ARMY BUYS AGFA SYSTEMS
• GE ACQUIRES PANAMETRICS
• FLIR IMAGER FOR AIR NATIONAL GUARD
• RVSI GETS WAFER INSPECTION ORDER
• ZYGO RECEIVES ORDER FROM LLNL
• YXLON TAKES OVER PHILIPS TUBE HEADS
• GOVERNMENT ORDERS X-RAY INSPECTION VANS
• AS&E PROTECTS U.S. ATTORNEYS
• TAIWAN FOUNDRY ORDERS FEI DUALBEAM SYSTEM
• TSA ORDERS INVISION EDS
• KEITHLEY MOVES TO DIRECT SALES FORCE
• WAFER-INSPECTION SYSTEM ORDERS
• RVSI MAY SELL INSPECTION BUSINESS
• METROLOGY CONTRACT AWARDED TO ZYGO
• ZYGO TO DISPOSE TERAOPTIX UNIT
• COGNEX SELECTED BY STEEL MANUFACTURER
• U.S. CUSTOMS ORDERS AS&E SYSTEMS
• FEI RECEIVES MULTIPLE ORDERS
• FLIR LAUNCHES THERMAL IR CAMERA
• DOD GRANT FOR QUANTUM MAGNETICS
• RVSI INSPECTION SYSTEMS ORDERS
• VEECO WINS MULTIPLE ORDERS
• TAIWANESE FOUNDRY BUYS ADE INSPECTION TOOL
• ADE RECEIVES $4.5M KOREAN ORDER
• SWEDISH COMPANY CHOOSES COGNEX
• SAMSUNG SELECTS COGNEX WAFER READER
• AGFA TRENDSETTING ON THE ECOLOGICAL TRACK
  • AGFA TRENDSETTING ON THE ECOLOGICAL TRACK (CONTINUED)
  • AGFA TRENDSETTING ON THE ECOLOGICAL TRACK (CONTINUED)

INFRARED

• THERMAL IMAGING DIAGNOSES FUEL CELLS
• MAKING MAPS OF VOLCANIC HAZARDS
  • MAKING MAPS OF VOLCANIC HAZARDS (CONTINUED)
• FLIR LAUNCHES LOW-COST IR CAMERA
• SMALLER AND STEALTHIER
• IMAGING CAMERA IS FIREFIGHTING TOOL
• FIBER-OPTIC ENDOSCOPE
• IRVISTA SOFTWARE FOR IR CAMERA

NEW TECHNOLOGY

• ASSESSING VULNERABILITY OF STRUCTURES
  • ASSESSING VULNERABILITY OF STRUCTURES (CONTINUED)
• LASER MAPS BASALT CRYSTALS, BACTERIA
  • LASER MAPS BASALT CRYSTALS, BACTERIA (CONTINUED)
• NEW APPROACH TO CHEMICAL SENSORS
  • NEW APPROACH TO CHEMICAL SENSORS (CONTINUED)
• CHEMICAL NOSE SNIFFS OUT BIOTERROR
• CHEMICAL SENSORS ON A DIME
  • CHEMICAL SENSORS ON A DIME (CONTINUED)
• SILICON EXPLOSIVES AS SENSORS
  • SILICON EXPLOSIVES AS SENSORS (CONTINUED)
• SENSOR DETECTS INVISIBLE AGENTS
• X-RAY MOVIE CAMERA
  • X-RAY MOVIE CAMERA (CONTINUED)
  • X-RAY MOVIE CAMERA (CONTINUED)
• ORGANIC LED SENSOR DEBUTS
  • ORGANIC LED SENSOR DEBUTS (CONTINUED)
• MICROSCOPIC MICROSCOPE
  • MICROSCOPIC MICROSCOPE (CONTINUED)
• REAL-TIME CORROSION MONITORING
  • REAL-TIME CORROSION MONITORING (CONTINUED)
  • REAL-TIME CORROSION MONITORING (CONTINUED)
• LASERS FOR 3-D IMAGING
  • LASERS FOR 3-D IMAGING (CONTINUED)
• PORTABLE MINE DETECTOR
• DETECTING HIDDEN NUCLEAR MATERIAL
  • DETECTING HIDDEN NUCLEAR MATERIAL (CONTINUED)
• DETECTING HIDDEN WEAPONS
• IMPROVED TESTING OF UNDERGROUND CABLES
  • IMPROVED TESTING OF UNDERGROUND CABLES (CONTINUED)
• DUST PARTICLES DETECT BIOCHEMICAL AGENTS
  • DUST PARTICLES DETECT BIOCHEMICAL AGENTS (CONTINUED)
• IMAGING APPARATUS FOR COMBUSTION RESEARCH
  • IMAGING APPARATUS FOR COMBUSTION RESEARCH (CONTINUED)
• MODEL PREDICTS DEFECT'S BIRTHPLACE
  • MODEL PREDICTS DEFECT'S BIRTHPLACE (CONTINUED)
• MATERIALS TESTING WITH NEUTRONS
• LASER ANALYZES FUEL FLAME
• ELECTRICAL IMAGING TO ASSESS POLLUTION
  • ELECTRICAL IMAGING TO ASSESS POLLUTION (CONTINUED)

OPTICAL

• SMALL HI-RES CMOS CAMERA
• ZYGO ENHANCES METROLOGY SOLUTION
• ZMI 500 SERIES METROLOGY SOLUTIONS
• PRECISE OPTICAL POWER MEASUREMENT
• AUTOMATED WAFER BACKSIDE INSPECTION
  • AUTOMATED WAFER BACKSIDE INSPECTION (CONTINUED)
• HAND-HELD PARTICULE MONITORS
• KLA-TENCOR UNVEILS CD METROLOGY SYSTEMS
  • KLA-TENCOR UNVEILS CD METROLOGY SYSTEMS (CONTINUED)
• AUTOMATED WAFER BACKSIDE INSPECTION
• NEW SYSTEM FOR SECURE IDENTIFICATION
  • NEW SYSTEM FOR SECURE IDENTIFICATION (CONTINUED)
  • NEW SYSTEM FOR SECURE IDENTIFICATION (CONTINUED)
• COGNEX EXPANDS IN-SIGHT FAMILY
• GOLD BUMP WAFER INSPECTION
• SILICON BENCH PACKAGING PLATFORM
• FURNACE SENSOR CUTS POLLUTION
• LASER DIODE TEST INSTRUMENT
  • LASER DIODE TEST INSTRUMENT (CONTINUED)
• PHOTOMASK SYSTEM MEETS STANDARDS
• DEEP UV LASER INSPECTION
  • DEEP UV LASER INSPECTION (CONTINUED)
• NON-CONTACT LASER MEASUREMENT
• 3-D SURFACE PROFILER INTROS
• NANO-ZOOM METROLOGY SYSTEM
• DUV LITHOGRAPHY METROLOGY TOOL
  • DUV LITHOGRAPHY METROLOGY TOOL (CONTINUED)
• WAFER FLATNESS FOR 35-NM TECH
• SOI INSPECTION AND METROLOGY
• VISION SENSOR FOR WAFER IDENTIFICATION
• NEW RETICLE INSPECTION OPTION
  • NEW RETICLE INSPECTION OPTION (CONTINUED)
• SPEED IMPROVEMENT IN WAFER INSPECTION
• HIGH-SPEED DEVICE INSPECTION
• HIGH-PERFORMANCE TAPE-AND-REEL SYSTEM
• VERIFIRE INTRODUCES INTERFEROMETER LINE
• HIGH-SPEED 3-D SCANNING SYSTEM
• AUTO ID CAPABILITIES
• NON-CONTACT MEASUREMENT SYSTEM
• HIGH-SPEED MACHINE VISION CAMERA
• TIRE & WHEEL IDENTIFICATION
• MEASURING TEXTILE SHADE CONSISTENCY
• 3.9MM DIAMETER VIDEO BORESCOPE
• DEFECT MONITORING SOLUTION
  • DEFECT MONITORING SOLUTION (CONTINUED)
• HIGH-SPEED MACHINE VISION MICRO-SYSTEM
• 5-MM VIDEOSCOPE FOR AIRCRAFT INSPECTIONS
• TURBINE INSPECTION USING VIDEO DEVICE
• NONCONTACT SCANNING SURFACE PROFILOMETERS
  • NONCONTACT SCANNING SURFACE PROFILOMETERS (CONTINUED)
• NANOTOPOGRAPHY AND WAFER GEOMETRY METROLOGY
• VIDEOPROBE XL PRO ENHANCEMENTS
• VIDEO INSPECTION SYSTEM
• FAST INTEGRATED CMP METROLOGY
• LASER PROFILER FOR CMP PROCESS CONTROL
  • LASER PROFILER FOR CMP PROCESS CONTROL (CONTINUED)
  • LASER PROFILER FOR CMP PROCESS CONTROL (CONTINUED)

PATENTS

• METHOD CHECKS SPOT WELDS
• LOOKING FOR WORKPIECE RESIDUES

PUBLICATIONS

• COGNEX REPORT ON VISION SENSORS
• ULTRASONIC TRAINING SOFTWARE ON CD-ROM
• CD COVERS MATERIALS TESTING

RADIOGRAPHIC

• INVISION ENHANCES CTX LINE OF EDS
• NIST TOOL HAS X-RAY EYES
• NASA SATELLITE CARRIES AMETEK X-RAY DETECTOR
• IN-LINE DEFECT CLASSIFICATION
• DIGITAL IMAGING TO STUDY COLLECTIONS
• PORTABLE RADIATION DETECTOR
  • PORTABLE RADIATION DETECTOR (CONTINUED)
• IMAGING WITH COHERENT DIFFRACTION
• ION TRAP MASS SPEC
• BOARDING PASS DETECTS EXPLOSIVES
  • BOARDING PASS DETECTS EXPLOSIVES (CONTINUED)
• LN₂-FREE COOLING SYSTEM OFFERED
• BURIED CRACK DETECTION
• POINT-SOURCE X-RAY LITHOGRAPHY
  • POINT-SOURCE X-RAY LITHOGRAPHY (CONTINUED)
• AS&E CEO ADDRESSES NCSC CONFERENCE
• FEI JOINS DAMASCUS INDUSTRY ALLIANCE
• NEXT-GENERATION EXPLOSIVES DETECTION
• VARIAN GETS INVOLVED IN EDS
  • VARIAN GETS INVOLVED IN EDS (CONTINUED)
• DETECTION OF RADIOACTIVE MATERIALS
• ADVANCED IN-FAB DEFECT ANALYSIS
• AUTOMATED ATOMIC FORCE MICROSCOPE
• DETECTING HIGH TEMPERATURE CREEP
• TYPIFYING ULTRATHIN INSULATING MATERIALS
  • TYPIFYING ULTRATHIN INSULATING MATERIALS (CONTINUED)
• COOLED GAMMA-RAY DETECTORS
• NDT TECHNIQUE TO PROBE METEORITE
• 3-D CT SCANNING SYSTEM

RESEARCH

• ND TESTING OF LUMBER
• WAVELETS APPLIED TO NDT DATA
• MULTIPLE TECHNIQUES FOR STRUCTURAL MEASUREMENTS
• NONDESTRUCTIVE BALL INDENTATION TECHNIQUE
• EVALUATION OF CERAMIC COMPOSITES
• ULTRASONICS COMBINED WITH OPTICS
• THERMOGRAPHY APPLIED TO CFRP

SOFTWARE

• ACTIVEX-BASED MACHINE VISION
• EMBEDDED VISION IN LABVIEW
• DATA ACQUISITION, MOTION CONTROL
• KLA-TENCOR LAUNCHES SUPPORT PROGRAM
• PATMAX GEOMETRIC PATTERN MATCHING
• METROLOGY AND AUTOMATED CONTROL
• REAL-TIME OVERLAY METROLOGY ANALYSIS
• PROGRAM TESTS AND CERTIFIES TRANSDUCERS
• ARCHIVING BORESCOPE INSPECTION DATA
• WINSPECT ADDS POWERFUL PROCESSORS
• VISION SYSTEM SOFTWARE LIBRARY
• MACHINE VISION INSPECTION SOFTWARE
  • MACHINE VISION INSPECTION SOFTWARE (CONTINUED)

TRAINING COURSES

• EVEREST VIT OFFERS RVI TRAINING
  • EVEREST VIT OFFERS RVI TRAINING (CONTINUED)

• PROBE OPTIONS FOR EXTREME APPLICATIONS
• ECHOMAX TRANSDUCERS GAIN ATEX APPROVAL
• MULTIRANGER LEVEL TRANSCEIVER
  • MULTIRANGER LEVEL TRANSCEIVER (CONTINUED)
• PAPER MEASUREMENT WITH LASER ULTRASONICS
  • PAPER MEASUREMENT WITH LASER ULTRASONICS (CONTINUED)
• SLUDGE BLANKET LEVEL MONITOR
• MILLTRONICS LEVEL METER WINS AWARD
• PANAMETRICS WINS PRODUCT AWARDS
• ULTRASMALL FORCE MEASURING SYSTEM
• THICKNESS GAGE OFFERS SUBMICRON RESOLUTION
• PORTABLE 5-AXIS SCANNING SYSTEM
• EPOCH 4B FLAW DETECTOR
• MODULAR TEST ELECTRONIC SYSTEMS
  • MODULAR TEST ELECTRONIC SYSTEMS (CONTINUED)
  • MODULAR TEST ELECTRONIC SYSTEMS (CONTINUED)
• INSPECTION OF RAIL WHEELS
• R/D TECH LAUNCHES MULTISCAN MS5800
• BONDLINE TESTING OF HONEYCOMB STRUCTURES
• MTC WINS APPROVAL FROM ROLLS-ROYCE
• ISONIC OFFERS FLAW DETECTOR
• MULTIPLEXER FOR FLAW DETECTORS
• ELLIPSOIDAL HORNS DETECT LEAKS
• INTRINSICALLY SAFE WALL THICKNESS GAUGE
  • INTRINSICALLY SAFE WALL THICKNESS GAUGE (CONTINUED)