Chemical Mechanical Polishing Equipment and Materials: A Technical and Market Analysis

SUMMARY

Polishing and planarization are related in that polishing improves the flatness (planarity), smoothness and optical properties of a surface.Planarization, however, is a much more critical process. Integrated circuit (IC) manufacturers must planarize each surface layer of an in-processwafer to make it level for the next application of microlithography.

Chemical mechanical planarization (CMP) is used during the semiconductormanufacturing process to planarize individual layers in complex integrated circuits to customer-specific parameters. CMP is a critical technology inthe planarization of multilevel metallization systems and in shallow trench isolations (STIs) in semiconductor manufacturing. The rapid emergence ofcopper and low-k dielectrics as interconnect structures for integrated circuits has further pushed CMP technology to the forefront of semiconductormanufacturing.

CMP polishes a wafer with a moving pad containing an abrasive chemical slurry. The CMP equipment precisely regulates not only thepad's position, motion and pressure, but also the chemical composition and size of particles in the slurry. Such equipment also increases theprecision of photolithography and reduces defects caused by metal residues.

STUDY GOALS AND OBJECTIVES

The technology of CMP is wellestablished in the back-end of IC manufacturing, where it was developed to remove variations (bumps) in metallization layers of multi-layer PCB. Theshift to smaller CDs and the adoption of new technologies such as low-k dielectric materials and copper interconnect has increased the specificationsand challenges for a smooth planar wafer surface. The result has been the rapid adoption of CMP in front-end wafer processing.

BCC had published aseries report on nanomaterials and nanoceramics from 1994 and as late as 2003. These nanomaterials find applications in CMP, the market that wasestimated in these reports. BCC also published the first report on Equipment and Materials for Semiconductor Cleaning and Planarization in 2001. Sincethen, several new developments have taken place, especially with the feature sizes in most advanced Ics decreasing to less than 0.15 microns, and CMPhas become an important operation for semiconductor manufacturing. Other applications are also emerging for CMP, in particular, in memory devices.

Themarket for CMP equipment alone will reach almost $1 billion dollars in 2003. CMP slurry and CMP pad markets have also grown substantially in the lastfive years. With new developments in the offing and continued secrecy on the part of those involved in this industry, BCC felt a need to thoroughlyanalyze this industry, including the technology and markets, along technological and business issues, new developments and the trends in CMPequipment, materials and applications.

The objectives of this report are as follows:

• Provide an in-depth analysis of CMP technology and its applications.
• Identify the technological and business issues related to the CMP technologies.
• Analyze the domestic and foreign competition among companies within each of the market segments.
• Determine the current size and future growth of the markets for CMP and post-CMP equipment, CMP slurries, CMP pads and pad conditioners, andother CMP consumables.
• Identify and profile all worldwide producers of CMP and post-CMP equipment.
• Identify and profile all worldwide producers and suppliers of CMP slurries, CMP pads and pad conditioners as well as suppliers of nanoparticlesfor CMP slurries.
• Identify major users of CMP equipment, slurries, pads and pad conditioners
• Analyze major new developments in the use of CMP.
• Identify technology change and its impact on CMP business.

CONTRIBUTION OF THE STUDY

BCC's technical/economic study covers CMP equipment, post-CMP equipment, CMP slurries, CMP pads, CMP padconditioners, filters for CMP process and other chemicals needed for CMP. The technology, materials and new developments have been analyzed. Currentsize and future growth of the markets are estimated for the period 2002 to 2008. The report analyzes the competitive environment within each of themarkets for CMP equipment, slurries, pads and other accessories and consumables. This report discusses the technology trends in products andapplications so as to assist the suppliers of equipment and materials with their long-range planning. The report profiles all worldwide companies thatare involved in the CMP area.

FORMAT AND SCOPE

The report has been organized according to CMP and post-CMP equipment, CMP slurries, CMPpads and pad conditioners, and other consumables used in the CMP process. Each section provides the technology, equipment or material types, newdevelopments, industry structure, company profiles, and market. Since the CMP industry is highly networked on a global scale, BCC has conducted thisanalysis with global perspective.

An industry overview has been provided to condense all the detailed analyses of each segment. A technology reviewhas been conducted on polishing and planarization, CMP and types of CMP. Finally, all companies that are current users of CMP equipment, slurries andother CMP consumables are profiled.

The qualitative and quantitative judgments embodied in this report are a valuable contribution to the currentknowledge of advanced ceramic powders and nano-sized ceramic powders, their processing techniques, applications and markets. Moreover, this study hasbeen conducted at a vital stage in the development of this growing industry, where decisions need to be made by a number of companies about theirstrategies of involvement and expansion as well as whether or not to enter new areas of business.

METHODOLOGY AND INFORMATION SOURCES

Thefindings of this report are based on information derived from interviews with almost all producers and suppliers of CMP and post-CMP equipment, CMPslurries, CMP pads and other consumables. Industry experts in planarization were also contacted for this study. BCC also spoke to some researchersconducting R&D in CMP process and slurries. In addition, many end users were contacted to evaluate the current and future demand for CMPequipment, and CMP slurries and materials. In all, about 100 persons from over 60 companies and institutions were contacted for this study.

Secondarydata were obtained from trade publications, technical journals, CMP and nanomaterials conference proceedings, government statistics and the BCC, Inc.Database.

WHO SHOULD SUBSCRIBE?

This report is directed to the various strata of companies that are interested in the developments in thisfield such as the following:

• companies involved in the development, manufacturing and supplying of advanced materials
• manufacturers of semiconductor equipment
• manufacturers and suppliers of CMP and post-CMP equipment
• manufacturers and suppliers of CMP slurries and nanoparticles
• manufacturers and suppliers of CMP pads and pad conditioners
• semiconductor manufacturers
• manufacturers of hard disks, MEMS, flat panel displays and ferroelectric memories
• manufacturers of filters for CMP process
• chemical companies interested in diversification
• venture capital companies and financial institutions interested in new, attractive investments and acquisitions

TABLE OF CONTENTS

• STUDY GOALS AND OBJECTIVES
• CONTRIBUTION OF THE STUDY
• FORMAT AND SCOPE
• METHODOLOGY AND INFORMATION SOURCES
• WHO SHOULD SUBSCRIBE?
• RELATED BCC, INC. PUBLICATIONS
  • REPORTS
  • MONTHLY NEWSLETTERS
• RELATED BCC, INC. INDUSTRY REVIEWS
• RELATED BCC, INC. CONFERENCES
• BCC ONLINE SERVICES

• Summary Table:
  WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND OTHER CONSUMABLES, THROUGH 2008
• Summary Figure:
  WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND OTHER CONSUMABLES, 2003-2008 ($ MILLIONS)

• SEMICONDUCTOR APPLICATIONS
• MEMORY DEVICE APPLICATIONS
• MARKETS
  • WORLD MARKET SEGMENTS
• Table 1 WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT AND CONSUMABLES, 2002-2008
• Figure 1 MARKET SHARES FOR CMP AND POST-CMP EQUIPMENT AND CONSUMABLES, 2003 AND 2008 (%)
  • REGIONAL MARKETS
• Table 2 MARKET SHARES ACCORDING TO REGION, 2003 (%)
• Figure 2 WORLDWIDE CMP MARKETS ACCORDING TO REGIONS, 2003 (%)
  • INDUSTRY STRUCTURE
• Table 3 GLOBAL PRODUCERS OF CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND CMP PAD CONDITIONERS
• Table 3 (CONTINUED)
  • COMBINED CMP MARKET
• Table 4 WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, SLURRY, CHEMICALS, PADS, PAD CONDITIONERS AND FILTERS, THROUGH 2008 ($ MILLIONS)

• POLISHING AND PLANARIZATION
• CHEMICAL MECHANICAL PLANARIZATION (CMP)
• Figure 3 CMP PROCESS
  • TYPES OF CMP PROCESSES
    • INTER-LAYER CMP
      • Oxide Polishing
      • Metal Polishing
    • DRY-IN DRY-OUT OR DRY-IN WET-OUT SYSTEMS
    • SHALLOW TRENCH ISOLATION
    • DAMASCENE

• CLEANING AND PLANARIZING
• NEW DEVELOPMENTS
  • INTERCONNECT TECHNOLOGY GOES BEYOND THE 90-NM BARRIER
  • NOVA MEASURING INSTRUMENTS GRANTED TWO PATENTS
  • APPLIED MATERIALS AWARDED PATENT IN CMP ENDPOINT DETECTION TECHNOLOGY
  • INTEL PLANS NEW CHIP DESIGN CENTER IN TAIWAN
• CMP EQUIPMENT INDUSTRY STRUCTURE
  • COMPANY PROFILES
    • Applied Materials, Inc.
    • Applied Materials, Inc. (Continued)
    • CMP Technology, Inc.
    • EBARA Corp.
    • CMP Systems
    • G&P Technology, Inc.
    • Lam Research Corp.
    • Lam Research Corp. (Continued)
    • Lam Research Corp. (Continued)
    • Lapmaster International - U.S.
    • Metron Technology
    • Microbar Inc.
    • Nova Measuring Instruments, Ltd.
    • Nutool, Inc.
    • Okamoto Machine Tool Works, Ltd.
    • Peter Wolters AG
    • Rudolph Technologies
    • Semitool, Inc.
    • SpeedFam International, Inc.
    • IPEC Merger
    • Principal Activities
    • Double-side Lapping Machines
    • Wafer Planarization Systems
    • Sales
    • Operations
    • Strasbaugh
  • ACQUISITIONS, MERGERS AND JOINT AGREEMENTS
    • Semitool and SpeedFam Form Technical Alliance for Copper CMP
    • Strasbaugh and Lam Research in Strategic Agreement
    • Novellus Acquires Speedfam-IPEC
• MARKETS FOR CMP EQUIPMENT
  • SEMICONDUCTOR MARKETS
    • Global Sales
    • Sector Sales
    • Computer Sales
    • Japan and China
    • Taiwan
    • Overall Revenue Comparisons
    • Fab Ramp-Ups
    • Automotive Market
    • Regional Recoveries
    • Global Market Outlook
    • Asia Market Outlook
    • Industry Revenue History and Forecast
• Table 5 SEMICONDUCTOR INDUSTRY REVENUES, HISTORY AND FORECAST, THROUGH 2008 ($ BILLIONS)
  • SEMICONDUCTOR EQUIPMENT MARKET
    • Japan
    • North America
    • Equipment Spending
    • Fab Construction
    • Taiwan
  • CMP EQUIPMENT MARKET
    • Market Segments
    • Copper Chip Technology/Applied Materials
    • Market Drivers
    • Monitoring and Control Capabilities
    • Processing Time
    • Copper Contamination
    • Market History and Forecast
• Table 6 CMP EQUIPMENT REVENUES, THROUGH 2008 ($ MILLIONS)
  • Market Share of Companies
• Table 7 CMP EQUIPMENT - MARKET SHARE OF COMPANIES IN 2003 (%)
  • THE POST-CMP EQUIPMENT MARKET
    • The Post-CMP Equipment Market (Continued)
• Table 8 POST-CMP EQUIPMENT MARKET, THROUGH 2008 ($ MILLIONS)
  • Wet Process Post-CMP Equipment
  • Dry and Other Process Post-CMP Equipment
  • COMBINED CMP AND POST-CMP EQUIPMENT MARKET
• Table 9 COMBINED CMP AND POST-CMP EQUIPMENT MARKET, THROUGH 2008 ($ MILLIONS)
  • TECHNOLOGY CHANGES AND IMPACT ON CMP
    • Copper Interconnect and Lower k Value
    • High-k Material
    • Wafer Processing
    • Wafer Shortage, Seen Ahead
    • Wafer Shortage, Seen Ahead (Continued)

• FORM AND DELIVERY
• TYPES
  • OXIDE CMP SLURRY
    • Fumed and Colloidal Slurries
    • Production and Processing Requirements
• Table 10 REQUIREMENTS OF CMP SLURRIES
  • Materials Requirements
• Table 11 TYPICAL OXIDE CMP SLURRY CHARACTERISTICS
  • Performance Requirements
• Table 12 OXIDE CMP PERFORMANCE REQUIREMENTS, 1998 THROUGH 2000
  • METAL AND COPPER CMP SLURRY
    • Production and Processing Requirements
    • Production and Processing Requirements (Continued)
    • Materials Requirements and Formulations
• Table 13 TYPICAL COPPER CMP SLURRY COMPOSITION
  • Copper CMP Issues
  • Technical Requirements and Challenges
  • Pads
  • Defectivity
  • Low-k Materials
  • Alternatives to CMP
  • Metrology
  • NEW DEVELOPMENTS
    • U.S. DEVELOPMENTS
      • Praxair and Bayer Co-Develop Colloidal Silica CMP Slurries
      • Spinel Particle Slurry Avoids Scratching
      • Cabot Improves CMP Dielectric Slurry for Tenfold Reduction in Microscratches
      • Thomas West's CMP Polishing Pad Cuts Slurry Use By Half
      • Two U.S. Patents to Arch Microelectronic Materials for Copper CMP Slurries
    • DEVELOPMENTS OUTSIDE THE U.S.
      • Hitachi's Abrasive-Free Polishing Eases Switch to Copper Chips
      • MgO Slurry Polishes without Liquid Oxidant
      • Toshiba Develops CMP Slurry Containing Silicon Nitride Nanoparticles
      • Two-Step CMP Process Boosts Throughput
  • CMP SLURRY INDUSTRY STRUCTURE
    • PRODUCER SPECIALTIES
• Table 14 PRODUCERS OF ABRASIVE PARTICLES AND SLURRIES FOR PRECISION POLISHING AND CMP
  • COMPANY PROFILES
    • Air Products Electronics Division
    • Alcoa World Chemicals
    • Baikowski International Corp.
    • Baikowski Malakoff, Inc.
    • Baikowski Chemie
    • Bayer Corp.
    • Cabot Microelectronics Corp.
    • Dielectric CMP
    • Dielectric CMP
    • Tungsten CMP
    • Copper CMP
    • Disk Drive Slurry
    • Rigid Disk
    • Magnetic Heads
    • Clariant Corp.
    • DuPont Air Products/DA NanoMaterials, LLC
    • Dupont Air Products/DA Nanomaterials, LLC (Continued)
    • DuPont EKC Technology, Inc.
    • Dupont EKC Technology, Inc. (Continued)
    • EKA Chemicals Colloidal Silica Group
    • Ferro Corp.
    • FSI International
    • Fujimi Corp.
    • Fujimi Corp. (Continued)
    • Hitachi Chemical Co., Ltd.
    • JSR Corp.
    • Moyco Precision Abrasives, Inc.
    • Nissan Chemical Industries, Ltd.
    • Planar Solutions
    • Praxair Surface Technologies, Inc.
    • 3M
    • Rodel, Inc.
    • Thomas West, Inc.
  • RECENT ACQUISITIONS, LICENSING AND JOINT VENTURES
    • Motorola, DA NanoMaterials Team to Market Slurry
    • Rodel to Supply Eternal Chemical's Copper CMP Slurry
    • Companies Form Alliances to Develop and Commercialize Slurry-Free CMP
    • Nanophase Gets Foot into CMP Business as Rodel Supplier
    • Air Products Acquires ASC Business Unit
  • PATENT DISPUTES
  • CMP SLURRY MARKETS
    • APPLICATIONS
    • SLURRY PRICES
• Table 15 2002 CMP SLURRY PRICES ($/GALLON)
  • MARKET SHARE OF COMPANIES
• Table 16 MARKET SHARE OF COMPANIES IN CMP SLURRIES, 2002 (%)
• Figure 4 MARKET SHARE OF COMPANIES IN CMP SLURRIES, 2002 (%)
  • BARRIER TO ENTRY AND KEY SUCCESS FACTORS
  • MARKETS AND FORECASTS
    • Assumptions
    • Market Drivers
    • Pre-911 Growth Estimates
    • Revised Growth Rate Estimates
    • Slurry Consumption Value 2001 to 2002
    • Slurry Consumption Value 2002 to 2008
• Table 17 PRICE AND VOLUME CONSUMPTION OF CMP SLURRIES, THROUGH 2008
• Table 18 WORLD MARKET FOR CMP SLURRIES, THROUGH 2008
• Figure 5 SHARE OF CMP SLURRIES BY TYPE, 2003 AND 2008 (%)
• Table 19 WORLD MARKET FOR CMP SLURRIES BY APPLICATION, THROUGH 2008

• OTHER CMP CHEMICALS
  • MARKET FORECAST
• Table 20 OTHER CHEMICAL REQUIREMENTS FOR CMP, THROUGH 2008 ($ MILLIONS)
  • PADS, PAD CONDITIONERS, FILTERS
    • CMP PADS
    • CMP PAD CONDITIONERS
    • FILTERS FOR CMP
    • NEW DEVELOPMENTS
      • Rodel Partners with Kinik to Co-Develop and Market CMP Pad Conditioners
      • P.B.S.® Brand Bonding System for Pad Conditioners
      • Rodel Enhances IC1000 CMP Pad Offerings
      • Diamond Grid CMP Pad Dresser Boosts CMP Productivity
      • Rodel's New Pad Lowers Polishing Defects
      • Thomas West Introduces Improved CMP Pad
      • Factors Influencing CMP Pad Conditioner Performance
      • Diamonex Introduces Diabond
      • JSR Corp. Commissions New CMP Pad Manufacturing Facility
      • Silterra Reduces Consumable Cost with New Pad
    • INDUSTRY STRUCTURE/COMPANY PROFILES
      • Abrasive Technology, Inc.
      • Ade Corp.
      • Air Products Electronics Division
      • Cabot Microelectronics
      • Dainippon Screen Mfg. Co., Ltd.
      • Daitron Machinery Division
      • Frontier Semiconductor Measurements, Inc.
      • Freudenberg Vliesstoffe Kg
      • Fujibo
      • Fujimi
      • Heureka corp. Ltd.
      • Intelligent Enclosure Corp.
      • JSR Corp.
      • Kinik-Sales (Thailand) Co., Ltd.
      • Luxtron
      • Mipox International
      • Mitsubishi Materials
      • Okamoto Machine Tool Works, Ltd.
      • PPG Industries
      • PRI Automation
      • Rodel, Inc.
      • Rodel, Inc. (Continued)
      • Semco Corp.
      • Semiconductor Production Systems
      • TBW Industries
      • Thomas West, Inc.
      • Tokyo Seimitsu
      • 3M
      • Universal Photonics, Inc.
    • MARKET PLAYERS AND LEADERS
• Table 21 PRODUCERS OF CMP PADS AND PAD CONDITIONERS
• Table 21 (CONTINUED)
• Table 22 CMP PAD SUPPLIERS AND THEIR MARKET SHARE, 2002 (%)
  • PRICES
  • MARKET FORECAST
• Table 23 MARKETS FOR CMP PADS, PAD CONDITIONERS AND FILTERS, THROUGH 2008 ($ MILLIONS)
  • CMP Pads
• Table 24 WORLD MARKET FOR CMP PADS ACCORDING TO PAD TYPES, THROUGH 2008
  • Pad Conditioners
  • Filters Forecast

• USERS OF CMP EQUIPMENT, SLURRIES AND CONSUMABLES
  • ADVANCED MICRO DEVICES (AMD)
  • ANALOG DEVICES, INC.
  • APPLIED MICRO CIRCUITS CORP. (AMCC)
  • ATMEL CORP.
  • BEIJING XUNCHUANG IC CO., LTD.
  • CHARTERED SEMICONDUCTOR MANUFACTURING
  • CHIPPAC, INC.
  • CYPRESS SEMICONDUCTOR
  • DALLAS SEMICONDUCTOR CORP.
  • FUJITSU, INC.
  • GRACE SEMICONDUCTOR MANUFACTURING CORP. (GSMC)
  • HEWLETT-PACKARD
  • HITACHI
  • HOLMATE SEMICONDUCTOR INC.
  • HOLTEK SEMICONDUCTOR
  • HUAHONG NEC
  • HUAXIA SEMICONDUCTOR MANUFACTURING CO., LTD.
  • HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
  • IBM MICROELECTRONICS
  • INFINEON TECHNOLOGIES AG
  • INFINEON TECHNOLOGIES RICHMOND
  • INTEGRATED DEVICE TECHNOLOGY (IDT)
  • INTEL
  • INTERSIL CORP.
  • LSI LOGIC CORP.
  • LUCENT TECHNOLOGIES
  • MICRON TECHNOLOGY
  • MITSUBISHI ELECTRIC SEMICONDUCTOR GROUP
  • MAXIM INTEGRATED CIRCUITS
  • MOSEL-VITELIC
  • MOTOROLA
  • NATIONAL SEMICONDUCTOR CORP.
  • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
  • NIPPON ELECTRIC CORP. (NEC)
  • PHILIPS SEMICONDUCTORS
  • RENESAS TECHNOLOGY CORP.
  • RICOH CO., LTD.
  • SAMSUNG ELECTRONICS CO. LTD.
  • SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. (SMIC)
  • SHANGHAI HONGLI SEMICONDUCTOR MANUFACTURING CO.
  • ST MICROELECTRONICS N.V.
  • SHARP CORP.
  • SHARP ELECTRONICS CORP. U.S.A.
  • SIEMENS AG
  • SILTERRA
  • SHANGHAI HUA HONG NEC ELECTRONICS, LTD.
  • SONY SEMICONDUCTOR COMPANY OF AMERICA
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TSMC)
  • TEXAS INSTRUMENTS
  • TOSHIBA CORP.
  • UNITIVE ADVANCED SEMICONDUCTOR PACKAGING
  • UNITIVE SEMICONDUCTOR TAIWAN CORP.
  • UNITRODE COPORATION/TEXAS INSTRUMENTS
  • VANGUARD INTERNATIONAL SEMICONDUCTOR CORP.
  • VLSI TECHNOLOGY
  • WAFERTECH
  • WINBOUND ELECTRONICS CORP.
  • WORLDWIDE SEMICONDUCTOR MANUACTURING CORP.

LIST OF TABLES

Summary Table:
WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND OTHER CONSUMABLES, THROUGH 2008

Table 1 WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT AND CONSUMABLES, 2002-2008

Table 2 MARKET SHARES ACCORDING TO REGION, 2003 (%)

Table 3 GLOBAL PRODUCERS OF CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND CMP PAD CONDITIONERS

Table 4 WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, SLURRY, CHEMICALS, PADS, PAD CONDITIONERS AND FILTERS, THROUGH 2008 ($ MILLIONS)

Table 5 SEMICONDUCTOR INDUSTRY REVENUES, HISTORY AND FORECAST, THROUGH 2008 ($ BILLIONS)

Table 6 CMP EQUIPMENT REVENUES, THROUGH 2008 ($ MILLIONS)

Table 7 CMP EQUIPMENT - MARKET SHARE OF COMPANIES IN 2003 (%)

Table 8 POST-CMP EQUIPMENT MARKET, THROUGH 2008 ($ MILLIONS)

Table 9 COMBINED CMP AND POST-CMP EQUIPMENT MARKET, THROUGH 2008 ($ MILLIONS)

Table 10 REQUIREMENTS OF CMP SLURRIES

Table 11 TYPICAL OXIDE CMP SLURRY CHARACTERISTICS

Table 12 OXIDE CMP PERFORMANCE REQUIREMENTS, 1998 THROUGH 2000

Table 13 TYPICAL COPPER CMP SLURRY COMPOSITION

Table 14 PRODUCERS OF ABRASIVE PARTICLES AND SLURRIES FOR PRECISION POLISHING AND CMP

Table 15 2002 CMP SLURRY PRICES ($/GALLON)

Table 16 MARKET SHARE OF COMPANIES IN CMP SLURRIES, 2002 (%)

Table 17 PRICE AND VOLUME CONSUMPTION OF CMP SLURRIES, THROUGH 2008

Table 18 WORLD MARKET FOR CMP SLURRIES, THROUGH 2008

Table 19 WORLD MARKET FOR CMP SLURRIES BY APPLICATION, THROUGH 2008

Table 20 OTHER CHEMICAL REQUIREMENTS FOR CMP, THROUGH 2008 ($ MILLIONS)

Table 21 PRODUCERS OF CMP PADS AND PAD CONDITIONERS

Table 22 CMP PAD SUPPLIERS AND THEIR MARKET SHARE, 2002 (%)

Table 23 MARKETS FOR CMP PADS, PAD CONDITIONERS AND FILTERS, THROUGH 2008 ($ MILLIONS)

Table 24 WORLD MARKET FOR CMP PADS ACCORDING TO PAD TYPES, THROUGH 2008

 LIST OF FIGURES

Summary Figure:
WORLDWIDE MARKETS FOR CMP AND POST-CMP EQUIPMENT, CMP SLURRIES, CMP PADS AND OTHER CONSUMABLES, 2003-2008 ($ MILLIONS)

Figure 1 MARKET SHARES FOR CMP AND POST-CMP EQUIPMENT AND CONSUMABLES, 2003 AND 2008 (%)

Figure 2 WORLDWIDE CMP MARKETS ACCORDING TO REGIONS, 2003 (%)

Figure 3 CMP PROCESS

Figure 4 MARKET SHARE OF COMPANIES IN CMP SLURRIES, 2002 (%)

Figure 5 SHARE OF CMP SLURRIES BY TYPE, 2003 AND 2008 (%)