Electronic Materials Industry Review 2005

SUMMARY

INTRODUCTION

With the new age of electronics, consumers constantly demand increased output with higher efficiency. As the industry works to meet these demands, new materials have emerged which could change the course for the industry. With the past year, energy efficiency has become even more important, and the most efficient will ultimately win out.

Consistent industry growth and burgeoning technology are introduced with more and more rapidity. With new people to drive the market, grants, and mergers the industry will grow and continue as strong as ever.

Based on the monthly newsletter Electronic Materials Update this anthology informs readers of the growing fields of compound substrates, dielectrics, industry news, research, patents, metals and interconnects, nanoelectronics, organic materials, process chemicals and gases, silicon substrates, and more.

TABLE OF CONTENTS

• INTRODUCTION
• 2004: A LOOK BACK... A LOOK AHEAD
  • New Materials Prove Essential
  • Strained Silicon
  • Gallium Nitride
  • Conducting Polymers
  • Environment
  • Thermal Management
  • Business Trends: Asia
  • Optoelectronics
  • Nanoelectronics
  • Developments to Watch
    • Developments to Watch (Continued)
• BUSINESS
  • Sanyo Will Produce Blue Lasers
  • JSR Markets Symyx Polymers
  • Air Liquide to Supply AMD Fab
  • National E-Waste Agreement Unlikely
  • PCB Laminate Maker Restructures
  • California eRecycle Law Takes Effect
  • Soitec Signs Contract With AMD
  • New SiC Plant in Sweden
  • Cree, Nichia Cross-License LEDs
  • Honeywell Opens Chemicals Plant
  • Praxair to Supply Samsung
  • Isola Will Fight Rogers Suit
  • Photonics Manufacturer Licenses Patents
  • Honeywell Receives Supplier Awards
  • Air Liquide Expands in Korea
  • Air Products Raises More Prices
  • New SiC Substrate Facility
  • Crystal IS Expands AlN Facility
  • GaN Device Market to Grow
  • Voltaix Expands Trimethylsilane Capacity
  • New IPC Materials Standard
  • Isola Buys Glass Cloth Manufacturer
• COMMENTARY
  • Low-k Development Is Dragging Its Feet
  • The Future of CMOS Technology
    • The Future of CMOS Technology (Continued)
  • Is RoHS a Four-Letter Word?
  • Is RoHS a Four-Letter Word? (Continued)
• COMPOUND AND SILICON SUBSTRATES
  • Flexible Transistors Use Oxide Film
  • Honeywell Offers Sapphire Wafers
    • Honeywell Offers Sapphire Wafers (Continued)
  • Fujitsu Develops Low-Cost GaN HEMTs
  • GaN-on-Insulator Wafers Introduced
    • GaN-on-Insulator Wafers Introduced (Continued)
  • Graded Material Produces Fastest Transistor
  • Fast Pace for Strained Silicon
    • Fast Pace for Strained Silicon (Continued)
    • Fast Pace for Strained Silicon (Continued)
  • Update on Strained Silicon Approaches
    • Update on Strained Silicon Approaches (Continued)
    • Update on Strained Silicon Approaches (Continued)
    • Update on Strained Silicon Approaches (Continued)
• DIELECTRICS
  • Low-k Technology Prevents Degradation
    • Low-k Technology Prevents Degradation (Continued)
• ENVIRONMENT
  • China to Issue Green Electronics Regulations
    • China to Issue Green Electronics Regulations (Continued)
  • Intel Ahead on Lead-Free, Packaging
  • Update on RoHS Directive
    • Update on RoHS Directive (Continued)
  • Global e-waste Market to Cross $11 Billion by 2009
    • Table 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, THROUGH 2009 ($ MILLIONS)
    • Figure 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, 2002-2004 AND 2009 ($ MILLIONS)
• INDUSTRY INSIGHT
  • Will Indium Tin Oxide Shortages Slow LED Growth?
    • Is ITO in Short Supply?
    • Lack of Raw Materials
    • Conclusion
• INDUSTRY NEWS
  • Shin-Etsu Expanding Wafer Capacity
  • Gas Suppliers Raise Prices Yet Again
  • Licenses for Strained Silicon Technology
  • Nichia, Nakamura Settle for $8 Million
  • Kopin Forms LED JV In Asia
  • Epoxy Curing, Solvent Prices Increase
  • Antimony Trioxide Price Goes Up
  • Austrian JV for High-Brightness LEDs
  • II-VI plans 100 mm SiC Scale-up
  • Revival Signs in Industry Statistics
  • EMCORE Consolidates Solar Cell Operations
  • Matheson Forms Linde Nippon Sanso JV
  • FINANCIAL REPORTS
    • MEMC Continues Strong Sales
    • Soitec Also Strong
    • Cabot Revenues Fall
    • Gas Suppliers Report Sales Records
    • GaAs Up, InP Down at AXT
    • Cree Gains Once More
    • Cabot Revenues Drop
    • Park Does Better
  • GRANTS AND FUNDING
    • Universal Wins SBIR for IR OLEDs
    • Evident Awarded SBIR for Quantum Dots
    • NVE Receives STTR for Spintronics
    • Funding for GaAs MOSFETs
    • DARPA Awards Cree, Raytheon $27 Million
  • PEOPLE
    • Honeywell Appoints Materials VP
    • Park Names President of Neltec
    • DuPont Researcher Receives IMAPS Award
    • IQE CEO Appointed Academy Fellow
    • AXT Appoints New CEO
    • Technical Marketing VP at Park
  • RECENT EARNINGS
    • Cree Strength Continues
    • Parks Markets Slow
    • Kopin Revenues Up
    • ATMI Finishes Strong Year
    • Record Year for Rogers
  • RECENT PATENTS
    • Molybdenum Eliminates Tungsten Interconnect Breakage.
    • Assembly Tape for QFN Packages
    • Spintronics Magnetic Field Sensor
    • GaAsInN-HBT Wafer Technology
  • RESEARCH
    • Ferroelectric Nanodisks May Increase Memory Storage
    • Metal Oxide Films by Polymer-Assisted Deposition
    • Nanotubes Form Along Atomic Steps
    • Fluorine Ion Implantation Stabilizes NiSi
    • DNA May Hold Key to Data Storage
    • External VCSEL Emits Visible Light
    • ZnSnO Transparent Transistors
    • III-V Nanowires Grown on Silicon
    • Supercapacitors From Carbon Nanotubes
    • Chip-Scale Magnetometer
    • AIXTRON, IHP Sign High-k Alliance
    • Magnetic Silicon for Spintronics?
    • Raman Laser Chip Invented
    • Enzyme Can Cut DNA Wires
    • New Phase-Change Memory Material
    • QCLs Operate Above Room Temperature
    • Prototype OLED Light Source
    • Semiconductors From Artificial Peptides
  • WHO'S WHO IN ELECTRONIC MATERIALS
    • A Pioneering Innovator In Electronic Devices
      • A Pioneering Innovator in Electronic Devices (Continued)
      • A Pioneering Innovator in Electronic Devices (Continued)
• MARKET ANALYSIS
  • Industry Numbers Not Looking Good
  • Industry Statistics Still in Doldrums
  • Report on AlGaInP Laser Diode Market
  • Industry Numbers Are Confusing
  • Industry Numbers Hold Steady
    • Industry Numbers Hold Steady (continued)
• METALS AND INTERCONNECTS
  • Molecular Wires for Conductive Adhesives
    • Molecular Wires for Conductive Adhesives (Continued)
  • iNEMI Previews Lead-Free Report
  • Worldwide Market for Power Supply and Management SemiconDuctors to Reach $43.5 Billion by 2010
    • Worldwide Market for Power Supply .. (continued)
  • Table 2 WORLDWIDE MARKET FOR POWER SUPPLY AND MANAGEMENT SEMICONDUCTOR DEVICES AND POWER MANAGEMENT SOFTWARE FOR ELECTRONICS, THROUGH 2010 ($ MILLIONS)
• NANOELECTRONICS
  • Flexible Circuits From Metal Rubber
  • Nanocomposite for Heat Spreaders
    • Nanocomposite for Heat Spreaders (Continued)
• ORGANIC MATERIALS
  • More Efficient Plastic Solar Cells
  • Biomolecule Acts as Molecular Switch
  • Organic FETs Use Ferroelectric Gate
    • Organic FETs Use Ferroelectric Gate (Continued)
• STRATEGIC AND OTHER MATERIALS
  • Collaboration Needed for Next-Generation
    • Collaboration Needed for Next-Generation (Continued)
  • Laminate for Lead Free Assembly
  • Resins Improve Carrier Tape Productivity
    • Resins Improve Carrier Tape Productivity (Continued)
  • Cookson Launches Solder Flux
  • Dow Corning Launches Flip-Chip Adhesive
  • IS640 Laminates Intro at Isola
  • Cute Enables Thinner Multilayer Laminates
  • Dow Corning Intros Thermal Grease, Gel
    • Dow Corning Intros Thermal Grease, Gel (Continued)
  • EMI Gaskets with Conductive Adhesives
• PROCESS CHEMICALS AND GASES
  • More Ammonia, Bulk Gases from Asia
    • More Ammonia, Bulk Gases from Asia (Continued)
• TECHNOLOGY
  • Cree Achieves Brightest White LED
  • Dow Corning Intros Thermal Encapsulant
  • Leadframe Technology Licensed by Psi
  • NanoInk Licenses Patent Family
  • Packaging Technologies From Du Pont
  • MEC Offers Carbon-Fiber Piezo Bimorphs
  • Soitec, ASM Produce 300 mm sSOI Wafers
  • IBM Utilizes Strained Germanium
  • NEC Intros High-k, FUSI Gate
  • Higher Power in AlGaN/GaN HEMTs
  • LED Array Sets Output Record
  • Laminate Passes Lead-Free Testing
  • Tecan Offers Package Lids
  • Kyma Adds GaN Substrates
  • HRL Licenses InP MMIC Technology
  • Halogen-Free Elastomer for Damping
  • Ultrasmall Thick-Film Resistor
  • MEC Intros Multilayer Actuators
  • High-Brightness LEDs From Lumileds, Osram
    • High-Brightness LEDs From Lumileds, Osram (Continued)
  • InSb Quantum Well Transistors are Ultrafast
  • Rohm Planning ZnO LEDs
• TECHNOLOGY INSIGHT
  • Ceramic Dielectric Materials In Electronics and Telecommunications
    • Antenna Technology
    • Ceramic Properties
    • Other Applications
    • The Future
  • Enhanced Sputtering Targets For MRAM Applications
    • Buffer Layers Tantalum
    • Free Ferromagnetic Layer
    • AlOx Tunneling Barrier
    • Other Layers
    • Conclusion
  • Wafer-Level Packaging Technology for On-Chip Passives
    • Alternating Layers
    • Increased Performance
    • Conclusion
• LIST OF TABLES
  • Table 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, THROUGH 2009 ($ MILLIONS)
  • Table 2 WORLDWIDE MARKET FOR POWER SUPPLY AND MANAGEMENT SEMICONDUCTOR DEVICES AND POWER MANAGEMENT SOFTWARE FOR ELECTRONICS, THROUGH 2010 ($ MILLIONS)
• LIST OF FIGURES
  • Figure 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, 2002-2004 AND 2009 ($ MILLIONS)