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SUMMARY
Bishop & Associates, Inc. has just published a new seven chapter researchreport providing a complete analysis of The World Market for 2mm BackplaneConnector Systems. This report provides detailed statistics on the world2mm backplane connector market by product type, geographic region and end-usemarket sector for the years 2001 and 2002. Five-year forecasts are alsoprovided for the year 2007. This report provides a complete analysis of the 2mm connector market withsections covering: - World market size by product type (Types 1, 2, 3 and 4) for 2002 and 2003.
- Product features of the four major types:
- The size of the 2002 market by geographic region of the world, I.e. NorthAmerica, Europe, Japan, Asia/Pacific and Rest-Of-World (ROW).
- 2002 market for the four major product types by region of the world.
- World sales by major end-use market for 2002.
- 2002 world sales by major end-use market and by geographic region.
- Forecast of the world market size for 2007 by region of the world and byproduct type.
- Forecast for end-use markets for 2007.
- Forecast world sales for 2007 by major end-use market and by geographicregion.
- 2002 market share of the major 2mm backplane connector manufacturers.
- A chart of leading manufacturers identifying the products each offers.
- Market strategies of the major 2mm connector manufacturers.
- Market trends in Pricing, Applications, Density, Computer Buses, FutureDevelopments, CEMs and Other Trends.
The four types of 2mm backplane connectors included in this report aredefined as follows: Type 1 2mm backplane and printed circuit board connectors in accordance withIEC 1076-4-001 (48B), EIA/SP 3179 and compatible with Futurebus +, IEEE P896architecture. Signal connector modules are in multiples of 4 rows by 6columns or 5 rows by 6 columns. Four row signal modules include24,48,96 and 192 contacts. Six row signal modules include 30,60,120, and240 contacts. These connectors were originally developed by BergElectronics as the "Metral" series. Manufacturers now offer a varietyof additional features including power and coax contact options. Type 2 2mm backplane and printed circuit board connectors which reference IEC61076-4-101 and Compact PCI bus per PICMG. Compact PCI uses a subset ofthe 2mm HM product array and has become a substantial market for this product. Modules have 5 or 8 rows of signal contacts or 5 +2 or 8+2 rows, the outer tworows being used for shielded versions. Additional hybrid modules includeprovisions for power, coax and fiber optic contacts. Some manufacturersoffer one piece molded monoblocks combining commonly ganged modules and reducingcustomer component inventory. Type 3 2mm backplane and printed circuit connectors developed by TeradyneCorp. and licensed to Molex (identical product). These 6 row connectorsare on a 2mm pitch and offer 72 and 144 position signal modules. Power, endblock and guidance modules are also available. Major innovations for thisHDM style include: (a) stiffeners which unitize signal, power and guidance toform one connector and (b) internal shielding (HDM +) to increase electricalperformance with single ended signals. Type 4 2mm backplane and printed circuit connectors which incorporateinternal shields and / or ground planes for higher speed electrical performance. These relatively new products are usually proprietary designs, and unlike types1-3, offer only some intermateability within the group. (New ZD types fromTyco and ERNI are intermateable. The VHDM and VHDM HSD from Molex andTeradyne are identical.) They are modular in design and, in some cases,provide a user migration path as system performance requirements increase. PCB footprint and interface grids vary to accommodate the necessary additionalinternal and external structures for impedance control. Many of theseinterfaces are designed for optimal performance of differential signals. World 2mm Market The world market for 2mm backplane connectors decreased in size from $648.0million in 2001 to $437.0 million in 2002. The five-year CAGR is forecast at9.3%, with the market reaching $683 million in 2007. TABLE OF CONTENTS
Chapter 1.0 Scope & Methodology- 1.1 Scope & Objectives of this Report
- 1.2 Study Methodology
Chapter 2.0 Introduction & Definitions- 2.1 Introduction
- 2.2 Definitions
- 2.3 Features of Connector Types 1, 2, 3 & 4
- Comparison Table: Types 1, 2, 3 & 4
- 2.4 Product Comparison
- 2.5 Application Tooling
Chapter 3.0 2MM Backplane Connector Market- 3.1 Size of the World Market
- 3.2 Market Size by Major Product Type
- Table: World Market-Types 1, 2, 3 & 4
- Chart: World Market by Product
- 3.3 Market Size by Geographic Region
- Table: World Market - Geographic Regions
- Chart: World Market - Geographic Regions
- Table: World Market by Product Type & Region
- 3.4 Major End Use Markets
- Table: World Market-End Use Markets
- Table: End Use Markets-Percent of Total
- Chart: End Use Markets - Percent of Total
- 3.5 Major End Use Markets by Geographic Region
- Table: 2002 Markets by World Region
- 3.6 Product Functions - Monoblock & Hybrid
Chapter 4.0 Forecast of 2MM Backplane Connectors- 4.1 World Market Forecast for 2007
- Table: World Market Forecast
- 4.2 World Market Forecast for Major Product Types
- Table: World Market Forecast by Type
- Chart: World Market Forecast by Type
- 4.3 Forecast by Geographic Region
- Table: World Forecast-Geographic Region
- Chart: World Forecast - Geographic Region
- Table: Forecast Product Type by World Region
- 4.4 Monoblock & Hybrid Connectors
- 4.5 Forecast of Major End Use Markets
- Table: World Market Forecast-End Use Markets
- Chart: World Market Forecast - End Use Markets
- 4.6 Forecast by Market & World Region
- Table: Major Markets by Region-2007
- 4.7 Quick Look at 2003
- Table: World Market Forecast by Type
Chapter 5.0 Manufacturers of 2MM Backplane and Mating Board Connectors- 5.1 Major Manufacturers and Market Share
- Table: 2002 World Sales & Market Share
- 5.2 Chart of Products by Major Manufacturer
- Table: Type 1 Comparison
- Table: Type 2 Comparison
- Table: Type 3 Comparison
- Table: Type 4 Comparison
- 5.3 Market Strategies of Major Manufacturers
- FCI
- Tyco
- Teradyne
- ERNI
- Molex
- 3M
Chapter 6.0 Market Trends- 6.1 Price Trends
- 6.2 Application Trends
- 6.3 Density Trends
- 6.4 Compact PCI Trends
- 6.5 Compact PCI vs. VME
- 6.6 Futurebus+ Trends
- 6.7 New Market Entrants
- 6.8 Future Backplane Connector Development Trends
- 6.9 CEM Trends
- 6.10 Other Trends
- 6.10.1 Capacity Utilization
- 6.10.2 OEM and CEM Breakout
- 6.10.3 Higher Performance Required
- 6.10.4 High Speed Backplane Performance
- 6.10.5 Potential Successors to 2mm
- 6.10.6 Surface Mount/Compressive Comments
Chapter 7.0 Major Findings & Conclusions
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