Semiconductor Manufacturing Capacity by Country in Asia, 2006

SUMMARY

Abstract

With 300mm fabs ramping up operations after 2004, Asia's semiconductor manufacturing capacity has continually grown, especially in Taiwan. With Taiwan building up its DRAM and foundry capacity over the years, it has become the highest fab density area worldwide. Semiconductor manufacturing in China is also picking up the pace, with sturdy local IC design industry and an emerging domestic market, which will support Chinese foundries. TSMC and UMC are the leading foundries in Asia, accounting for over 50% of Asia's output, up to 2009.

Asia's foundry capital spending grew more than 250% in 2004 over the previous year. The phenomenal growth in 2004 was mainly due to the fact that most of the companies were holding back their expansion plans during the 2001--2002 downturn.

The report details the semiconductor manufacturing capacity of various countries in Asia, and also looks at the capital spending trends in this industry. A separate section deals with the DRAM manufacturing in Asia.

TABLE OF CONTENTS

• Executive Summary
• Methodology
• Introduction and Overview
• Semiconductor Manufacturing in Asia--Background
• Asia Semiconductor Manufacturing Industry Outlook
  • Total Asia Manufacturing Capex Outlook & Forecast
    • Asia DRAM Companies' Capex Maintain a Capital Intensive Industries Condition
• Asia Semiconductor Manufacturing Development and 300mm Fab Review
  • Japan
    • More M&As
    • Japan IDMs' Interest in Foundry Business
  • Taiwan
  • South Korea
    • World-Leading Memory Makers
  • Singapore
  • China
    • China's Benchmark: SMIC
    • Homegrown Standards Help Domestic IC Design House Emerge
  • Total Asia Manufacturing Capacity Outlook & Forecast
  • Outlook & Forecast
    • Asia Foundry Semiconductor Manufacturing Capacity Outlook
    • Asia DRAM Manufacturing Capacity Outlook
• Asia Semiconductor Manufacturing: Industry Trends
  • Taiwan Foundry's Advantage
  • Dedicated Foundries Not Easily Shaken
  • 300mm Wafer Fab's Capital Risk
  • China Foundry's Opportunity
  • DRAM Capacity May Cause Over Supply
  • Common Phenomenon: Mergers & Alliances
• Asia Foundry Company Review
  • TSMC
  • UMC
  • SMIC
  • Chartered Semiconductor
  • DongbuAnam
• Asia Memory Company Review
  • Asia
    • Samsung Electronics
    • Hynix Semiconductor
    • Elpida Memory
  • Taiwan
    • Powerchip Semiconductor Corporation
    • Nanya Technology and Inotera Memory
    • ProMOS Technologies
    • Winbond Electronics Corporation
• Semiconductor Manufacturing Fabs: China
• Semiconductor Manufacturing Industry: West South Asia
  • Malaysia
  • Israel
  • India
• Conclusion and Recommendations
• Terminology
• List of Tables
  • Table 1. Asia Foundry Capex, 2003--2008 (US$ in Millions)
  • Table 2. Asia DRAM Capex, 2003--2008 (US$ in Millions)
  • Table 3. Japanese IDM Capex, 2003--2008 (US$ in Millions)
  • Table 4. Japan Chipmakers' 300mm Fab Overview
  • Table 5. Taiwan Chipmakers' 300mm Fab Overview
  • Table 6. South Korea Chipmakers' 300mm Fab Overview
  • Table 7. Singapore Chipmakers' 300mm Fab Overview
  • Table 8. China Chipmakers' 300mm Fab Overview
  • Table 9. Asia Semiconductor Manufacturing Development Overview
  • Table 10. Asia Semiconductor Manufacturing Capacity by Country, 2003--2008
  • Table 11. Asia Foundry Semiconductor Manufacturing Capacity Outlook, 2004--2009
  • Table 12. Asia DRAM Manufacturing Capacity Outlook, 2004--2009
  • Table 13. Wafer Fabs: TSMC
  • Table 14. Wafer Fabs: UMC
  • Table 15. Wafer Fabs: SMIC
  • Table 16. Wafer Fabs: Chartered
  • Table 17. Wafer Fab: DongbuAnam
  • Table 18. Foundry's Main Clients: 2005--2006
  • Table 19. Wafer Fabs in South Korea: Samsung
  • Table 20. Wafer Fabs in South Korea: Hynix
  • Table 21. Wafer Fabs in China: Hynix
  • Table 22. Wafer Fab: Elpida
  • Table 23. DRAM Companies: Taiwan
  • Table 24. First-Tier Semiconductor Manufacturing Companies in China
  • Table 25. Second-Tier Semiconductor Manufacturing Companies in China
  • Table 26. Wafer Fabs: Malaysia
  • Table 27. Wafer Fabs: Israel
  • Table 28. Wafer Fabs: India
• List of Figures
  • Figure 1. Asia Foundry Capex Trend, 2003--2008 (US$ in Millions)
  • Figure 2. Asia DRAM Capex Trend, 2003--2008 (US$ in Millions)
  • Figure 3. Japanese IDM Capex Trend, 2003--2008 (US$ in Millions)
  • Figure 4. Asia Semiconductor Manufacturing Capacity Trend by Country, 2003--2008
  • Figure 5. Asia Foundry Semiconductor Manufacturing Capacity Trend, 2003--2008
  • Figure 6. Asia DRAM Manufacturing Capacity Trend, 2003--2008
  • Figure 7. Asia Semiconductor Manufacturing Market Share by Country, 2006*
  • Figure 8. TSMC and UMC 300mm Wafers Capacity Ratio, 3Q04--4Q05
  • Figure 9. Asia Major Foundries Revenue Source, 2004--2006
  • Figure 10 Asia Major Foundries Process Technologies Comparison, 2004--2006
  • Figure 11. Major Foundries' Process Technologies Roadmap, 2001--2006
  • Figure 12. Elpida's Cooperation Relationships
  • Figure 13. China Foundry Out Utilization Trend, 2002--2007
  • Figure 14. China Domestic Foundries Market Share, 2005