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SUMMARY
REPORT DESCRIPTION:
A Comprehensive Analysis of the Nokia W-CDMA 2100MHz Power Amplifier
This report covers the design analysis of an Nokia W-CDMA 2100MHz power
amplifier unit. This unit is an integral part of an Nokia W-CDMA base
transmitting station (BTS). The unit was manufactured in mid 2002.
A complete bill of materials of all active semiconductors and passive
components is presented with the following information:
- Complete Part Number/Marking
- Component Manufacturer Identification
- Functional Component Description
- Package Type
THERE IS NO COMPONENT PRICING INFORMATION CONTAINED WITHIN THE REPORT.
TARGETED USERS:
- Mobile Operators
- Base Station Equipment OEMs
- RF Subsystems Manufacturers
- Semiconductor Manufacturers
BENEFITS:
- Proprietary Data
- Comprehensive Bill of Materials Analysis
- Mechanical Design Analysis
FEATURES:
- Total Pages: 67
- Total Tables: 27
- Total Exhibits: 65
- Full Color Pictures of PCB and Modules
- Mechanical Drawings and Dimensions
- Complete Part Number Identification
- Complete Component PCB Placement Identification
SUPPLIERS:
The following semiconductor & passive component suppliers are included in this report:
- AcBel Polytech,
- Ace Technology,
- Analog Devices,
- Anaren Microwave,
- Bourns,
- Fairchild Semiconductor,
- Freescale Semiconductor,
- International Rectifier,
- Kemet,
- Linear Technology,
- Maxim Integrated Circuits,
- Murata Electronics Co., Ltd.,
- ON Semiconductor,
- RF Microdevices,
- Skyworks Solutions,
- STMicroelectronics,
- Texas Instruments, and
- Xilinx.
TABLE OF CONTENTS
EXECUTIVE SUMMARY
- Active/Passive Component Summary
- Important Note:
CHAPTER 1: POWER AMPLIFIER TECHNOLOGY
- 1.1 Overview of Nokia UltraSite 3G BTS
CHAPTER 2: W-CDMA POWER AMPLIFIER PRODUCT
- 2.1 Mechanical Analysis
- 2.2 System Architecture Analysis
- 2.3 DC/DC Power Supply Section
- 2.4 RF Cavity Filter Section
- 2.5 Digital Baseband Section
- 2.6 High Power RF Section
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE
TABLES
- Table 1: Digital/RF Cable Bill of Materials
- Table 2: Power Supply Bill of Materials
- Table 3: M2 Module Bill of Materials
- Table 4: DC-DC Converter Module PCB Bill of Materials
- Table 5: DC-DC Converter Module Daughter Card 1 Bill of Materials
- Table 6: DC-DC Converter Module Daughter Card 2 Bill of Materials
- Table 7: Power Supply Connector PCB Bill of Materials
- Table 8: RF Cavity Filter Bill of Materials
- Table 9: Digital Baseband Section Bill of Materials Area 1
- Table 10: Digital Baseband Section Bill of Materials Area 2
- Table 11: Digital Baseband Section Bill of Materials Area 3
- Table 12: Digital Baseband Section Bill of Materials Area 4
- Table 13: Digital Baseband Section Bill of Materials Area 5
- Table 14: Digital Baseband Section Bill of Materials Area 6
- Table 15: Digital Baseband Section Bill of Materials Area 7
- Table 16: Digital Baseband Section Bill of Materials Area 8
- Table 17: Digital Baseband Section Bill of Materials Area 9
- Table 18: Digital Baseband Section Bill of Materials Area 10
- Table 19: Digital Baseband Section Bill of Materials Area 11
- Table 20: Digital Processor Module Bill of Materials
- Table 21: Area A Small Signal Pre Driver Amplifier Section Bill of
Materials
- Table 22: Area B RF Driver Pallet Bill of Materials
- Table 23: Area C High Power RF Output Pallet Bill of Materials
- Table 24: Area C High Power RF Input/Output PCB Bill of Materials
- Table 25: Area D High Power RF Error Amplifier Small Signal Bill of
Materials
- Table 26: Area E High Power RF Error Amplifier Driver/Output Pallet Bill
of Materials
- Table 27: Active/Passive Component Distribution by System Subsection
EXHIBITS
- Exhibit 1: Nokia UltraSite BTS
- Exhibit 2: Power Amplifier System Case Dimensions
- Exhibit 3: RF Cables 1
- Exhibit 4: RF Cables Component Diagram 1
- Exhibit 5: RF Cables 2
- Exhibit 6: RF Cables Component Diagram 1
- Exhibit 7: Digital Cables Component Diagram
- Exhibit 8: Digital Cables Component Diagram
- Exhibit 9: Power Amplifier Sub-System Diagram
- Exhibit 10: Power Amplifier RF Sub-System Diagram
- Exhibit 11: Power Supply Location
- Exhibit 12: Basic Feed Forward Amplifier Block Diagram
- Exhibit 13: Power Supply Location
- Exhibit 14: Power Supply Component Diagram
- Exhibit 15: M2 Module PCB Top View
- Exhibit 16: M2 Module PCB Bottom View
- Exhibit 17: DC-DC Converter Module, Top View
- Exhibit 18: DC-DC Converter Module Component Diagram
- Exhibit 19: DC-DC Converter Module Daughter Card 1
- Exhibit 20: DC-DC Converter Module Daughter Card 2
- Exhibit 21: Power Supply Connector PCB, Top View
- Exhibit 22: Power Supply Connector PCB, Bottom View
- Exhibit 23: RF Cavity Filter, Top
- Exhibit 24: RF Cavity Filter, Bottom
- Exhibit 25: RF Cavity Filter Transmit Diagram
- Exhibit 26: RF Cavity Filter, Bottom without Waveguide Shielding
- Exhibit 27: RF Cavity Filter, Top Component Diagram
- Exhibit 28: RF Cavity Filter, Bottom Component Diagram
- Exhibit 29: RF Cavity Filter, Bottom with Stripline PCBs Removed
- Exhibit 30: Digital Baseband Section PCB Top View
- Exhibit 31: Digital Baseband PCB Bottom View
- Exhibit 32: Digital Baseband Section Area 1
- Exhibit 33: Digital Baseband Section Area 2
- Exhibit 34: Digital Baseband Section Area 3
- Exhibit 35: Digital Baseband Section Area 4
- Exhibit 36: Digital Baseband Section Area 5
- Exhibit 37: Digital Baseband Section Area 6
- Exhibit 38: Digital Baseband Section Area 7
- Exhibit 39: Digital Baseband Section Area 8
- Exhibit 40: Digital Baseband Section Area 9
- Exhibit 41: Digital Baseband Section Area 10
- Exhibit 42: Digital Baseband Section Area 10 Top
- Exhibit 43: Digital Baseband Section Area 10 Middle
- Exhibit 44: Digital Baseband Section Area 10 Bottom
- Exhibit 45: Digital Baseband PCB Dimensions
- Exhibit 46: Digital Baseband Shield Bottom, Bottom View
- Exhibit 47: Digital Baseband Shield Bottom, Top View
- Exhibit 48: Digital Baseband Shield Top, Top View
- Exhibit 49: Digital Baseband Shield Top, Bottom View
- Exhibit 50: Digital Processor Module PCB, Top View
- Exhibit 51: Digital Processor Module PCB, Bottom View
- Exhibit 52: RF Shielding for Power Amplifier
- Exhibit 53: High Power RF Section Diagram
- Exhibit 54: High Power Pallet Shield Cover, Top and Bottom Views
- Exhibit 55: RF Main Amplifier Transmit Diagram
- Exhibit 56: Small Signal Pre Driver Amplifier Section Component Diagram
- Exhibit 57: RF Driver Pallet Component Diagram
- Exhibit 58: High Power RF Output Pallet Component Diagram
- Exhibit 59: High Power RF Error Amplifier Small Signal Section Component
Diagram
- Exhibit 60: High Power RF Error Amplifier Transmit Diagram
- Exhibit 61: High Power RF Error Amplifier Driver/Output Pallet Component
Diagram
- Exhibit 62: Component Distribution Analysis
- Exhibit 63: Passive Component Distribution Analysis
- Exhibit 64: Active Component Analysis by Pin Count
- Exhibit 65: Active Semiconductor Component Market Share
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