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SUMMARY
REPORT DESCRIPTION:
A Comprehensive Analysis of the Lucent Technologies UMTS CDMA UCR850
Transceiver Radio Model BNJ28B
This report covers the design analysis of an Lucent Technologies UCR850 BNJ28B
Transceiver Radio. This unit is an integral part of an Lucent Modcell CDMA
base transmitting station (BTS). The unit was manufactured in mid 2003.
A complete bill of materials of all active semiconductors and passive
components is presented with the following information:
- Complete Part Number/Marking
- Component Manufacturer Identification
- Functional Component Description
- Package Type
THERE IS NO COMPONENT PRICING INFORMATION
TARGEETED USERS:
- Mobile Operators
- Base Station Equipment OEMs
- RF Subsystems Manufacturers
- Semiconductor Manufacturers
BENIFITS:
- Proprietary Data
- Comprehensive Bill of Materials Analysis
- Mechanical Design Analysis
FEATURES:
- Total Pages: 25
- Total Tables: 6
- Total Exhibits: 17
- Full Color Pictures of PCB and Modules
- Mechanical Drawings and Dimensions
- Complete Part Number Identification
- Complete Component PCB Placement Identification
SUPPLIERS:
The following semiconductor & passive component suppliers are included in
this report:
Analog Devices, Coilcraft, CTS, Cypress Semiconductor, Epcos AG, Freescale
Semiconductor, International Rectifier, Kemet, M/A-COM, Maxim Integrated
Products, Micrel, Mini Circuits, Microwave Technology, Murata Electronics Co.,
Ltd., National Semiconductor, NXP Semiconductors, ON Semiconductor, RF
Microdevices, Skyworks Solutions, Texas Instruments, Vectron International,
and Xilinx
TABLE OF CONTENTS
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:
CHAPTER 1 - ALCATEL-LUCENT UMTS CDMA BTS
- 1.1 Overview of Alcatel-Lucent Flexent ModCell BTS
CHAPTER 2 - UMTS CDMA UCR RADIO TRANSCEIVER PRODUCT
- 2.1 Mechanical Analysis
- 2.2 Radio Transceiver Analysis
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE
TABLES
- Table 1: Section E Bill of Materials
- Table 2: Section A Bill of Materials
- Table 3: Section B: Bill of Materials
- Table 4: Section C Bill of Materials
- Table 5: Section D Bill of Materials
- Table 6: Active/Passive Component Distribution by System Subsection
EXHIBITS
- Exhibit 1: Lucent Flexent ModCell Outdoor BTS
- Exhibit 2: Radio Transceiver PCB Dimensions
- Exhibit 3: RF Shield, Bottom View
- Exhibit 4: Radio Transceiver Subsections, Front PCB
- Exhibit 5: Section E, Back PCB Component Diagram
- Exhibit 6: Section A: Digital Processing Component Diagram
- Exhibit 7: Section A Backplane Connector
- Exhibit 8: Section A Front Panel
- Exhibit 9: Section B Rx Component Diagram
- Exhibit 10: Section B Rx Chain Block Diagram
- Exhibit 11: Section C Frequency Generation Component Diagram
- Exhibit 12: Section D Tx Component Diagram
- Exhibit 13: Section D Tx Chain Block Diagram
- Exhibit 14: Component Distribution Analysis
- Exhibit 15: Passive Component Distribution Analysis
- Exhibit 16: Active Component Analysis by Pin Count
- Exhibit 17: Active Semiconductor Component Market Share
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