Electronic Thermal Management

SUMMARY

This report analyzes the worldwide markets for Electronic Thermal Management in Millions of US$. The major end-use segments analyzed are Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Electronic Thermal Management Hardware, Electronic Thermal Management Software, and Electronic Thermal Management Interfaces & Substrates. Annual forecasts are provided for each region and product segment for the period of 2003 through 2012. The report profiles 160 companies including many key and niche players worldwide such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansoft Corporation, Ansys, Inc., Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., CTS Corporation, Comair Rotron, Inc., Ceramics Process Systems Corporation, Chomerics, Cool Innovations, Inc., Cooler Master Co., Ltd., Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Flomerics, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Isonics Corporation, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mathis Instruments Ltd, Melcor Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, R-Theta Thermal Solutions, Inc., Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., Tennmax United, U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

• Study Reliability and Reporting Limitations
• Disclaimers
• Data Interpretation & Reporting Level
• Quantitative Techniques & Analytics
• Product Definitions and Scope of Study
• End-Use Segments
• Computers
• Telecom
• Medical/Office Equipment
• Industrial/Military
• Consumer Electronics
• Automotive
• Product Segments
• Hardware
• Software
• Interfaces and Substrates

II. EXECUTIVE SUMMARY

1. Industry Overview

• Sophisticated Technology Needs Effective Thermal Management
• Current and Future Analysis
• Regional Perspective
• End-Use Perspective
• Product Segment Perspective

2. Market Trends

• Rising Complexities Present Lucrative Opportunities for Electronic Thermal Management
• PC Market Stimulates Growth
• Thermal Management Subsystems Set for Robust Growth
• New Technologies Under Development
• Liquid Cooling Gaining Foothold
• Semiconductor Manufacturers Look for Thermal Management Technology
• Heat Pipe Gains Popularity among PC Manufacturers
• Imminent Growth for ICs

3. Product Overview

• Thermal Management - A Critical Function
• Electronic Thermal Management Products
• Hardware
• Heat Sinks
• Heat Pipes
• Micro Channels
• Spray Cooling
• Electronic Cooling Fans
• Metal Backplanes
• BGAs
• Software
• Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)
• Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD) Software, and Technology Computer Aided Design (TCAD) Software
• Interfaces and Substrates
• Thermal Compounds and Thermal Interface Materials
• Thermal Management Applications
• Computers
• Notebooks/Laptops
• Servers
• Embedded PCs
• Telecom
• Medical
• Industrial Electronics
• Aerospace/Military
• Consumer Electronics
• Automotive

4. Competitive Environment

• Thermal Management - A Fragmented Market
• Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart)
• Thermal Management Hardware Market
• Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)
• Fluent - The Undisputed Thermal Management S/W Market Leader
• Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart)
• Chomerics and Bergquist Lead Thermal Management Interface Market
• Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart)
• Amkor Dominates Thermal Management Substrate Market
• Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart)

5. Technological Development

• Heat Alleviation Technologies for Electronics

6. Product Developments/Introductions

• SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs
• LORD Develops Materials for Thermal Management
• Dow Corning Introduces New Thermally Conductive Compound
• Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures
• Dell Develops a Liquid-Cooled Heat Sink
• Fujipoly America Develops an Innovative Thermal Interface Material
• Flomerics to Offer T3Ster Thermal Testing System
• Andigilog® Develops ThermalEdge™ Cooling Technology
• Andigilog® Introduces Thermal Management Solutons
• Celsia Releases MicroSpreader™
• Sunon Develops Liquid Circulation Cooling System
• EBM-PAPST Develops Advanced Liquid Cooling System
• EBM-PAPST Introduces New Fan-Cooling Technology
• Hybricon Introduces Liquid-Cooled ATR Chassis
• Ansoft Launches Latest Version of ePhysics as ePhysics v2
• CTS Launches New Line of Low-Profile Forged Heat Sinks
• Honeywell Introduces Screen Printable Phase Change Material in Chip Manufacture
• Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for PCBs
• Laird Introduces Deep Drawing Capability for Shielding Applications
• Laird Introduces Low-Cost T-Gard™ for SMPS Devices
• Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive Industry
• Jaro Develops 450 CFM AC Cooling Fan for Industrial Use
• Jaro Develops IC Cooling Fan With High Flow and Cooling Value
• Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing
• Melcor Introduces Extrusion Heat Sinks With Improved Performance
• Fluent Launches New Environmental Thermal Audit Solution for Data Centers
• Kooltronic Introduces Advanced Enclosure Accessories
• Pfannerberg Develops Filterfan®
• Vette Introduces BGA Thermal Solutions
• Sp3 Launches New DiaThermm™ Diamond Heat Spreaders
• Andigilog Releases SC7511 as First in the Series of Intelligent Thermal Management Products
• Degree Controls’ Develops Cooling Products
• Dow Corning Launches Innovative Thermal Management Solutions
• CPS’ Metal Matrix Combination Delivers Sophisticated Thermal Management

7. Recent Industry Activity

• Moog Takes Over Thermal Control Products
• Rensselaer Teams Up with Varsities to Develop Cooling Techniques
• Laird Partners with Sager Electronics
• Honeywell to Expand R&D Facility
• Modine to Divest Thermacore
• Vette Adds ERM
• Laird Takes Over Supercool
• Arlington Capital Acquires Woven Electronics Through Thermal Solutions
• Parker Hannifin Purchases Acofab and Adecem
• Ametek Adds Land Instruments
• Lytron Adds Lockhart Industries
• Seki Technotron Purchases 10% Interest in sp3 Inc.
• OnScreen Purchases Patent of WayCool Thermal Cooling Technology
• Flomerics Acquires NIKA
• Aavid Merges with Ansys and Spins-Off Thermal Management Business
• Celsia and Yeh-Chiang Sign Agreement
• Nextreme Inks License Deal with Caltech
• Celsia Signs Sales & Development Pact with Lighting Science
• Celsia Contracts with Kubo to Expand in Japan
• Hybricon and Parker Hannifin Sign Pact for Cooling Solutions
• Rogers and Thermal Transfer Composites Partner
• sp3 Partners with CPS
• Celsia Teams Up with AET
• Mathis Forms Distribution Partnership with Setaram Instrumentation
• Pentair Takes Over APW’s Thermal Management Operations
• Helix Acquires IGC Polycold
• iCurie Signs Marketing and Sales Agreement with Advanced Energy Technology
• ISR Enters into Agreement with US Air Force to Develop Advanced Thermal Management System for Military Aircrafts
• Symmetry Electronics to Market Andigilog’s Thermal Management System
• ISR Starts Commercial Division for Advanced Electronics
• Vette Takes Over Shun Fu Metal Products
• Laird Acquires Thermagon
• AMETEK Acquires Hughes-Treitler

8. Focus on Select Global Players

• II-VI, Incorporated (USA)
• Marlow Industries (USA)
• Aavid Thermalloy, LLC (USA)
• Advanced Thermal Solutions, Inc. (USA)
• Alcoa, Inc. (USA)
• Alpha Metals (USA)
• Alpha Technologies Group, Inc. (USA)
• Ametek, Inc. (USA)
• Amkor Technology, Inc. (USA)
• Ansoft Corporation (USA)
• Ansys, Inc. (USA)
• Fluent, Inc. (USA)
• ASAT Holdings Ltd. (Hong Kong)
• Brush Engineered Materials, Inc. (USA)
• CTS Corporation (USA)
• Comair Rotron, Inc. (USA)
• Ceramics Process Systems Corporation (USA)
• Chomerics (USA)
• Cool Innovations, Inc. (USA)
• Cooler Master Co., Ltd. (UK)
• Daat Research Corp. (USA)
• Degree Controls, Inc. (USA)
• Dow Corning Corporation (USA)
• Dynatron Corporation (USA)
• Enertron, Inc. (USA)
• Flomerics (UK)
• Fujikura Ltd. (Japan)
• Henkel Loctite Corporation (USA)
• Honeywell Electronic Materials (USA)
• Isonics Corporation (USA)
• Intricast Company Inc (USA)
• ITW Vortec (USA)
• JARO Components, Inc. (USA)
• Kooltronic, Inc. (USA)
• Kyocera Corporation (Japan)
• Laird Technologies (USA)
• Liebert Corporation (USA)
• Lord Corporation (USA)
• Lytron Incorporated (USA)
• Mathis Instruments Ltd (Canada)
• Melcor Corporation (USA)
• Metal Matrix Cast Composites, LLC (USA)
• Micronel U.S. (USA)
• Netzsch Instruments, Inc. (USA)
• Netzsch Thermal Analysis (Germany)
• NMB Technologies Corporation (USA)
• Noren Products, Inc. (USA)
• Orient Semiconductor Electronics Ltd. (Taiwan)
• PC Power & Cooling, Inc. (USA)
• Pfannenberg, Inc. (USA)
• PLANSEE Thermal Management Solutions (USA)
• R-Theta Thermal Solutions, Inc. (Canada)
• Sumitomo Electric Industries, Ltd. (Japan)
• Tech Spray, L. P. (UK)
• Tellurex Corp. (USA)
• The Bergquist Company (USA)
• The Filter Factory, Inc. (USA)
• Thermacore (USA)
• Transene Company, Inc. (USA)
• Tennmax United (USA)
• U.S. Toyo Fan Corporation (USA)
  • United Thermal Engineering Corporation (USA)
  • Vette Corp. (USA)
  • Wakefield Thermal Solutions, Inc. (USA)

9. Global Market Perspective

• Table 6: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Product Segment- Hardware, Software, and Interfaces & Substrates Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 7: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 8: World 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 9: World 10-Year Perspective for Electronic Thermal Management by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 10: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Computers by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 11: World 10-Year Perspective for Electronic Thermal Management in Computers by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 12: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Telecom by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 13: World 10-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 14: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 15: World 10-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 16: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 17: World 10-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 18: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 19: World 10-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)
• Table 20: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Automotive by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 21: World 10-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

III. MARKET

1. United States

• A. Market Analysis
  • Current and Future Analysis
  • By End-Use Segment
  • By Product Segment
  • Rising Complexities Present Lucrative Opportunitiesfor Electronic Thermal Management
  • Price Pressures and Shifting of Manufacturing toAsia to Restrain Growth
  • Product Developments/Introductions
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 22: US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 23: US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 24: US 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)
  • Table 25: US 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

2. Canada

• A. Market Analysis
  • Current and Future Analysis
  • Product Development
  • Strategic Corporate Development
  • Key Players
• B. Market Analytics
  • Table 26: Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 27: Canadian 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

3. Japan

• A. Market Analysis
  • Current and Future Analysis
  • Strategic Corporate Development
  • Key Players
• B. Market Analytics
  • Table 28: Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 29: Japanese 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

4. Europe

• A. Market Analysis
  • Current and Future Analysis
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 30: European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 31: European 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

5. Asia Pacific

• A. Market Analysis
  • Current and Future Analysis
  • Taiwan Market Scenario
  • Strategic Corporate Developments
  • Key Players
• B. Market Analytics
  • Table 32: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
  • Table 33: Asia-Pacific 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

6. Rest of World

• Market Analysis
• Current and Future Analysis
• Table 34: Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)
• Table 35: Rest of World 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)