| Request a sample from "The Infoshop", another service of Global Information.
|
SUMMARY
This IDC study examines switch fabric/backplane semiconductor vendors.
"With limited R&D resources and rising nonrecurring engineering charges for
advanced ASICs, many OEMs are now opting for merchant ASSP approach to satisfy
more advanced switching/backplane requirements." - Sean Lavey, program manager,
Semiconductors
TABLE OF CONTENTS
- Table of Contents
- IDC Opinion
- In This Study
- Situation Overview
- Table: Worldwide Switch Fabric/Backplane ASSP Revenue by Vendor, 2002 and 2003
- Table: Worldwide Switch Fabric/Backplane ASIC and PLD Revenue by Vendor, 2002 and 2003
- Figure: Worldwide Switch Fabric/Backplane ASSP Revenue Share by Vendor, 2002 and 2003
- Figure: Worldwide Switch Fabric/Backplane ASIC and PLD Revenue Share by Vendor, 2002 and 2003
- Future Outlook
- Forecast Trends and Vendor Review
- Table: Multiprotocol Switch Fabric Product Matrix
- ATCA Gaining Further OEM Commitments
- Figure: 16-Slot ATCA Chassis Diagram
- Essential Guidance
- Learn More
- Related Research
- Definitions
- Synopsis
|
