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SUMMARY
This IDC study examines the 2004 market share of Ethernet semiconductor vendors
selling application-specific chips into LAN switching infrastructure and
NIC/LOM connectivity designs. For LAN switching, the high initial costs of
creating custom ASICs, especially at below 130-nanometer geometries, along with
increased availability of higher performance merchant ASSPs encouraged more
OEMs to outsource their designs. "We believe the majority of Layer 2 switch
solutions have already shifted to merchant ASSP approaches, while more
intelligent Layer 3 core and distribution switches are increasingly moving to
ASSPs." - Sean Lavey, program manager in IDC's Semiconductors group
TABLE OF CONTENTS
- Table of Contents
- IDC Opinion
- In This Study
- Situation Overview
- Table: Worldwide Ethernet Semiconductor Revenue by Vendor, 2003 and 2004
- Figure: Worldwide Ethernet Semiconductor Revenue Share by Vendor, 2003 and 2004
- Future Outlook
- Ethernet Switching
- Table: Chip Suppliers for Fast Ethernet with GbE Uplinks or Fast Ethernet-Only Switch OEMs
- Table: Chip Suppliers for GbE with 10GbE Uplinks or GbE-Only Switch OEMs
- Ethernet NIC/LOM Connectivity
- Essential Guidance
- Learn More
- Related Research
- Definitions
- Synopsis
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