Metrology, Inspection, and Process Control in VLSI Manufacturing

SUMMARY

Continuous innovations in microelectronics and materials science have led to the introduction of a broad array of electronic devices with increasing performance and decreasing size characteristics. Manufacturing these highly engineered products requires complex, multi-stage production processes, increasing the potential for defects and errors associated with equipment failures, contamination of materials, drift in process parameters, human error and other related factors. Manufacturing complexity also increases investment in work-in-progress inventories and lengthens production cycles. To better manage and enhance their yields, manufacturers are increasing their emphasis on automated testing and inspection at various points in the manufacturing process. As production processes become more complex and reducing material and labor cost becomes increasingly important, we believe that ongoing yield management provides manufacturers with an important competitive advantage.

Technical challenges revolve around the need to continually advance along the International Technology Roadmap for Semiconductors (ITRS) in order for the industry to provide increasing device performance and drive the economies of scale required to maintain profitability in a more competitive global environment. These challenges include the constant introduction of new materials and processes required as performance is increased and node size is decreased. For both the device manufacturer and equipment supplier, the most difficult challenges to overcome, however, may not be technical but economic.

Because of the consistent absence of the next "killer app", the industry has reached a new maturity. This has resulted in the dramatic reduction of a predictable and repeatable high-volume demand for higher-performing devices. This lack of a killer-app driver has greatly reduced the ability of device manufacturers to premium price products based on device performance and early availability. This trend has also resulted in a consolidating device manufacturing customer base whose strategy is increasingly focused on manufacturing excellence, in addition to technology excellence.

As a result, device manufacturers are increasingly operationally and financially focused, demonstrated by their aversion to risk during the most recent semiconductor upturn. They are much more cost-conscious, as margins are being squeezed more and more by pricing pressures. For the equipment manufacturer, this means that, in addition to developing products that are able to successfully process newly developed devices, they must also satisfy the new economic realities that the industry is facing. Nowhere is this challenge more evident for equipment suppliers than in metrology.

Metrology is not perceived as a value-added step but rather as a cost adder. However, given the huge challenge and accompanying risk of converting entire processes from aluminum to copper and maintaining control on that process in high-volume production, it may be a very valuable and necessary cost adder. To meet these criteria, this "new metrology" must have certain critical features in addition to acceptable measurement capability.

The semiconductor industry is entering an operationally driven era that represents a new set of challenges both technical and economic. Both the device and capital equipment manufacturers must change the way they approach these challenges to remain competitive. It is no longer sufficient to modify strategy and products from the previous technology-driven era. There needs to be some fundamental changes to the approach. The companies that successfully accomplish this will be the new emerging market leaders.

This report offers a complete analysis of the Process Control market. We follow standard conventions in analyzing the market as follows:

There are four major sectors

• Lithography Metrology
• Wafer Inspection/Defect Review
• Thin Film Metrology
• Other Process Control Systems

The Lithography Metrology sector is comprised of four major segments:

• Overlay
• CD Measurement
• Mask Inspection
• Mask Metrology

The Wafer Inspection/Defect Review sector is comprised of four major segments:

• Patterned Wafer Inspection
• Defect Review
• Unpatterned Wafer Inspection
• Macro Defect Inspection

The Patterned Wafer Inspection segment is further segmented by:

E-beam Patterned Wafer Inspection Optical Patterned Wafer Inspection

The Defect Review segment is further segmented by:

• SEM Defect Review
• Optical Defect Review
• "Other" Defect Review

The Thin Film Metrology sector is comprised of two major segments:

• Non-metal Thin Film Metrology
• Substrate / "Other" Thin Film Metrology

The Non-metal Thin Film Metrology segment is further segmented by:

• Non-Metal Standalone Thin Film Metrology
• Non-Metal Integrated Thin Film Metrology

The Other Process Control Systems segment is further segmented by:

• "Other" Process Control
• Software

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

TABLE OF CONTENTS

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Metrology/Inspection Technologies

• 3.1 Introduction
• 3.2 Imaging Techniques
  • 3.2.1 Scanning Electron Microscope (SEM)
  • 3.2.2 Transmission Electron Microscope (TEM)
• 3.3 Scanning Probe Microscopes
  • 3.3.1 Atomic Force Microscopy (AFM)
  • 3.3.2 Scanning Tunneling Microscopy (STM)
  • 3.3.3 Scanning Probe Microscopy (SPM)
  • 3.3.4 AFM Types
    • 3.3.4.1 Contact AFM
    • 3.3.4.2 Dynamic Force Mode AFM Techniques
  • 3.3.5 Scanning Surface Potential Microscopy (SSPM)
• 3.4 Optical Techniques
  • 3.4.1 Scatterometry
    • 3.4.1.1 Ellipsometry
    • 3.4.1.2 Reflectometry
    • 3.4.1.3 Scatterometry Developments
  • 3.4.2 Total Reflection X-Ray Fluorescence (TXRF)
  • 3.4.3 Energy Dispersive X-Ray Analysis (EDX)
  • 3.4.4 Secondary Ion Mass Spectrometry (SIMS)
    • 3.4.4.1 Surface Imaging Using SIMS
    • 3.4.4.2 SIMS Depth Profiling
  • 3.4.5 Auger Electron Spectroscopy
  • 3.4.6 Focused Ion Beam (FIB)
  • 3.4.7 X-Ray Reflectometry (XRR)
  • 3.4.8 X-Ray Photoelectron Spectroscopy (XPS)
  • 3.4.9 Rutherford Backscattering (RBS)
    • 3.4.10 Optical Acoustics Metrology
    • 3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)
    • 3.4.12 IDS 10000
    • 3.4.13 Thermally-Induced Voltage Alteration (TIVA)
• 3.5 Film Thickness And Roughness
  • 3.5.1 Surface Inspection Technology
  • 3.5.2 Dimensional Technology
  • 3.5.3 Stylus Profilometer

Chapter 4 Defect Review/Wafer Inspection

• 4.1 Introduction
• 4.2 Defect Review
  • 4.2.1 SEM Defect Review
  • 4.2.2 Optical Defect Review
  • 4.2.3 Other Defect Review
• 4.3 Patterned Wafer Inspection
  • 4.3.1 E-Beam Patterned Wafer Inspection
  • 4.3.2 Optical Patterned Wafer Inspection
• 4.4 Unpatterned Wafer Inspection
• 4.5 Macro-Defect Inspection

Chapter 5 Thin Film Metrology

• 5.1 Introduction
  • 5.1.1 Front End Applications
  • 5.1.2 Back End Applications
• 5.2 Metal Thin-Film Metrology
• 5.3 Non-Metal Thin-Film Metrology
• 5.4 Substrate Metrology

Chapter 6 Lithography Metrology

• 6.1 Overlay
• 6.2 CD
• 6.3 Mask (Reticle) Metrology/Inspection

Chapter 7 Market Forecast

• 7.1 Introduction
• 7.2 Market Forecast Assumptions
• 7.3 Market Forecast
  • 7.3.1 Total Process Control Market Forecast
  • 7.3.2 Lithography Metrology Market Forecast
    • 7.3.2.1 Overlay Market Forecast
    • 7.3.2.2 CD Measurement Market Forecast
    • 7.3.2.3 Mask Inspection Market Forecast
    • 7.3.2.4 Mask Metrology Market Forecast
  • 7.3.3 Wafer Inspection / Defect Review Market
    • 7.3.3.1 Patterned Wafer Inspection Market Forecast
      • E-Beam Patterned Wafer Inspection Market Forecast
      • Optical Patterned Wafer Inspection Market Forecast
    • 7.3.3.2 Defect Review Market Forecast
      • SEM Defect Review Market Forecast
      • Optical Defect Review Market Forecast
      • Other Defect Review Market Forecast
    • 7.3.3.3 Unpatterned Wafer Inspection Market Forecast
    • 7.3.3.4 Macro Defect Detection Market Forecast
  • 7.3.4 Thin Film Metrology Market Forecast
    • 7.3.4.1 Non-Metal Thin Film Metrology Market Forecast
      • Non-Metal Standalone Thin Film Metrology Market Forecast
      • Non-Metal Integrated Thin Film Metrology Market Forecast
    • 7.3.4.2 Substrate / Other Thin Film Metrology Market Forecast
  • 7.3.5 Other Process Control Systems Market Forecast

Chapter 8 Integrated/In-Situ Metrology/Inspection Trends

• 8.1 Introduction
• 8.2 In-Situ Metrology
• 8.3 Integrated Metrology
  • 8.3.1 Benefits
  • 8.3.2 Limitations

Chapter 9 Key Drivers

• 9.1 300mm Wafers
• 9.2 Copper Metrology
• 9.3 Low-K Dielectrics
• 9.4 Chemical Mechanical Planarization (CMP)
• 9.5 Ion Implant

LIST OF TABLES

• 3.1 Comparison Of Derivative AFM Techniques
• 5.1 Comparison Of White-Light With Multiple-Angle Laser Ellipsometry
• 7.1 Total Process Control Market Forecast
• 7.2 Lithography Metrology Market Forecast
• 7.3 Overlay Market Forecast
• 7.4 CD Measurement Market Forecast
• 7.5 Mask Inspection Market Forecast
• 7.6 Mask Metrology Market Forecast
• 7.7 Wafer Inspection / Defect Review Market Forecast
• 7.8 Patterned Wafer Inspection Market Forecast
• 7.9 E-Beam Patterned Wafer Inspection Market Forecast
• 7.10 Optical Patterned Wafer Inspection Market Forecast
• 7.11 Defect Review Market Forecast
• 7.12 SEM Defect Review Market Forecast
• 7.13 Optical Defect Review Market Forecast
• 7.14 Other Defect Review Market Forecast
• 7.15 Unpatterned Wafer Inspection Market Forecast
• 7.16 Macro Defect Detection Market Forecast
• 7.17 Thin Film Metrology Market Forecast
• 7.18 Non-Metal Thin Film Metrology Market Forecast
• 7.19 Non-Metal Standalone Thin Film Metrology Market Forecast
• 7.20 Non-Metal Integrated Thin Film Metrology Market Forecast
• 7.21 Substrate / Other Thin Film Metrology Market Forecast
• 7.22 Other Process Control Systems Market Forecast
• 9.1 Dielectric Film Challenges

LIST OF FIGURES

• 3.1 Schematic Of Scanning Electron Microscope
• 3.2 Schematic Of Transmission Electron Microscope
• 3.3 Schematic Of Atomic Force Microscopy
• 3.5 Interaction Between Two Atoms In AFM
• 3.6 Schematic Of Lateral Force Microscopy
• 3.7 Schematic Of Dynamic Force Mode AFM
• 3.8 Schematic Of Scanning Surface Potential Microscopy
• 3.9 Principle Of Scatterometry
• 3.10 Schematic Of Ellipsometer
• 3.11 Principles Of CD Scatterometry
• 3.12 Conventional TXRF Analysis Geometry
• 3.13 Schematic Of Secondary Ion Mass Spectrometry
• 3.14 Principle Of Auger Electron Emission
• 3.15 Schematic Of Auger Electron Spectroscopy
• 3.16 Schematic Of Focused Ion Beam Technology
• 3.17 Schematic Of X-Ray Reflectometry
• 3.18 Schematic Of X-Ray Photoelectron Spectroscopy
• 3.19 Schematic Of Rutherford Backscattering
• 3.20 Schematic Of Optical Acoustics Metrology
• 3.21 Spatial Wavelength Of Nanotopography
• 3.22 Schematic Of Non-Contact Capacitive Gauging
• 3.23 Schematic Of Stylus Profilometer
• 5.1 Thin Film Metrology Challenges
• 5.2 Spectroscopic Ellipsometry Diagram
• 6.1 ITRS Overlay Technology Roadmap
• 6.2 NIST Line Edge Roughness Model
• 6.3 ITRS Metrology Roadmap
• 6.4 Schematic Of OCD Optics
• 6.5 Microlithography Process And Measurements
• 7.1 Total Process Control Market Forecast
• 7.2 Total Process Control Market By Geographic Region
• 7.3 Total Process Control Market Vs. Overall Equipment Market 1995-2005
• 7.4 Lithography Metrology Market Shares - 2005
• 7.5 Overlay Market Shares - 2005
• 7.6 CD Measurement Market Shares - 2005
• 7.7 Mask Inspection Market Shares - 2005
• 7.8 Mask Metrology Market Shares - 2005
• 7.9 Wafer Inspection / Defect Review Market Shares - 2005
• 7.10 Patterned Wafer Inspection Market Shares - 2005
• 7.11 E-Beam Patterned Wafer Inspection Market Shares - 2005
• 7.12 Optical Patterned Wafer Inspection Market Shares - 2005
• 7.13 Defect Review Market Shares - 2005
• 7.14 SEM Defect Review Market Shares - 2005
• 7.15 Optical Defect Review Market Shares - 2005
• 7.16 Other Defect Review Market Shares - 2005
• 7.17 Unpatterned Wafer Inspection Market Shares - 2005
• 7.18 Macro Defect Detection Market Shares - 2005
• 7.19 Thin Film Metrology Market Shares - 2005
• 7.20 Non-Metal Thin Film Metrology Market Shares - 2005
• 7.21 Non-Metal Standalone Thin Film Metrology Market Shares - 2005
• 7.22 Non-Metal Integrated Thin Film Metrology Market Shares - 2005
• 7.23 Substrate / Other Thin Film Metrology Market Shares - 2005
• 7.24 Other Process Control Systems Market Shares - 2005
• 7.25 Other Process Software Market Shares - 2005
• 8.1 Integrated Control In A Fab
• 9.1 Polish Endpoint Control