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SUMMARY
Modular, multichamber, integrated process systems -- cluster tools -- have
achieved worldwide recognition, and have become widely accepted worldwide as a
key concept for VLSI manufacturing.
The rationale behind the cluster concept is to:
- Reduce cycle times
- Reduce wafer handling by operators
- Reduced particulate contamination
- Reduced molecular contamination
- Ability to initiate difficult processes
The perceived advantages of cluster tools comes at a time when the
semiconductor industry has been is a sustained growth period, when rising
costs has increased the cost of a 35,000 sq. ft. fab to $3 billion.
However, despite the claims for the advantages of cluster tools, quantitative
data have been largely unproven. Open architectures, which will open the flood
gates for standardization in the equipment industry, have not been established
sufficiently to prove their value. As a result, closed architecture systems
will continue to be sold throughout the timeframe of this study, even though
they may not necessarily provide the lowest cost or best technology for a
specific process. The attainment of a high reliability factor has prevented
any successful implementation of automation in an IC facility. The advent of
powerful, inexpensive microcomputers with high-speed data acquisition and
processing capabilities has enabled manufacturers to build equipment with
sufficient intelligence to monitor a variety of parameters. Advances in the
field of remote sensing and control components has also enabled these
functions to be measured with greater accuracy. A host or mode computer can
provide better wafer process control and tracking as well as accurate
diagnostic information should a problem occur.
Future cluster tools will implement much more sophisticated monitoring to
assure process functionality and provide a means of detecting and correcting
problems. To assure proper process completion and sequence, diagnostic tools
are being incorporated inside process modules for real-time communication
feedback. These tools will require highly developed internal system diagnostic
capability; highly integrated equipment will require intensive sensing
technology.
This report addresses these technical issues, presenting an analysis of the
industry, the key players, and the driving forces directing the cluster tool
concept. Markets are analyzed and are segmented by flexible and non-flexible
cluster tools.
TABLE OF CONTENTS
Chapter 1 Introduction
Chapter 2 Executive Summary
- 2.1Summary of Technical Issues
- 2.2Summary of Market Forecast
Chapter 3 Interface Standards
- 3.1SEMI/MESC
- 3.3 High-Speed Secs Message Services (HSMS) Standard
- 3.4GEM
- 3.5Standards Directions
Chapter 4 The Cluster Concept
- 4.1Definitions
- 4.2Device Technology and Integrated Processing
- 4.3Main Functional Units
- 4.3.1Central Handling Platform
- 4.3.2Cassette Stations
- 4.3.3Extension Modules
- 4.3.4Single Process Modules
- 4.3.5Batch Modules
- 4.3.6Multiple Process Modules
- 4.4Cluster Tool Communications
- 4.4.1Cluster Tool Controller
- 4.4.2Transport Module Controller
- 4.4.3Process Module Controller
- 4.4.4Control Software
- 4.4.5Human Interface Software
- 4.4.6Networking Software
- 4.5Vacuum System Design
Chapter 5 Commercial Cluster Tools
- 5.1Cluster Tools and Suppliers
- AIO
- Alcatel
- Anelva
- Apex
- Applied Materials
- ASM
- ASML
- Aviza Technology
- BLE Laboratory Equipment
- Brooks Automation
- Convac-APT
- Couger Labs
- DaiNippon Screen
- Ebara
- FSI International
- Genmark
- Genus
- Ginitech
- Hitachi
- IPS
- Jipelec
- Jusung Engineering
- Kanematsu Semiconductor
- Kokusai
- Kornic
- Lam Research
- Mattson Technology
- Modern Industries
- Modular Process Technology
- Novellus Systems
- Oxford Instruments Plasma Technology
- Primaxx
- Rorze
- Samsung Electronics
- SC Fluids
- Semitool
- Sentech
- Surface Technology Systems
- Suss MicroTec AG
- Tegal
- Tek-Vac
- Thermo Electron Corp.
- Tokyo Electron
- Trikon Technologies
- Ulvac
- Unaxis
- Vactronics Lab Equipment
- Veeco
- 5.2Process Modules and Suppliers
- AXIC
- Nanaometrics
- Nicolet
- Nova Measuring Instruments
- Pfeiffer Vacuum
- XMR
Chapter 6 Cluster Tool Process Trends
- 6.1Introduction
- 6.2Deposition - Plasma Etch
- 6.3Deposition - Rapid Thermal Processing
- 6.4Lithography - Resist Processing
- 6.5Diagnostics - Process
- 6.6CMP Polish - Clean
Chapter 7 Cluster Tool Issues
- 7.1Introduction
- 7.2Equipment Reliability
- 7.3Equipment Maintainability
- 7.4Challenges
- 7.5Opportunities
Chapter 8 Economic and Human Resource Issues
- 8.1 Introduction
- 8.2Economic Justification
- 8.2.1Background
- 8.2.2Cost Justification
- 8.2.3Reserves
- 8.2.4Personnel Costs
- 8.2.5Other ROI Considerations
- 8.3Human Resources Impact
- 8.3.1Background
- 8.3.2Direct Labor
- 8.3.3Equipment Support
- 8.3.4Process Engineering
- 8.3.5Operations Staff
Chapter 9 Market Forecast
- 9.1Introduction
- 9.2Market Forecast Assumptions
- 9.3Market Forecast
- 9.3.1Total Available Equipment Market
- 9.3.2Flexible Cluster Tool Market
- 9.3.3Non-Flexible Cluster Tool Market
- 9.3.4Total Cluster Tool Market
FIGURES
- 3.1Trend in Use of SECS by Equipment Manufacturers
- 4.1Basic Cluster Tool Architecture
- 4.2Basic Cluster Tool Architecture
- 4.3Communication Architecture in a Cluster Tool
- 5.1Anelva's Cu CVD Process Tool
- 5.2Process Chambers in Applied Materials'
- EPI Centura System
- 5.3Brooks Automation's Gemini Express 8000
- 5.4Process Chambers in Hitachi's M600 Etcher
- 8.1Segmentation of Operator Processing Functions
- 9.1Shares of the Total Available Market
- 9.2Market Forecast of Flexible Cluster Tools
- 9.3Market Shares of Flexible Cluster Tools
- 9.4Market Forecast of Non-Flexible Cluster Tools
- 9.5Market Shares of Non-Flexible Cluster Tools
- 9.6Cluster Tools vs Total Available Market
- 9.7Cluster Tools vs Total Available Market
- 9.8Cluster Tools as % of TAM
TABLES
- 3.1Corporate Participants in SEMI/MESC
- 4.1Model for DRAM Production Line
- 9.1Total Available Equipment Market Forecast
- 9.2Total Cluster Tool Equipment Market Forecast
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