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SUMMARY
CHAPTER 1
INTRODUCTION
Thin film deposition processes play a critical role in the production of
high-density, high-performance microelectronic products.
Considerable progress has been achieved in the development of deposition
processes -- and in the development of the reactor systems in which they are
carried out. This report discusses relevant mechanisms; processing,
system, and materials aspects, potential advances, and considerations
regarding extendibility to a wafer diameter of 300 mm.
With the introduction of new thin-film materials to consistently
shrinking microelectronic devices and circuits, and as the aperture ratio of
an integrated-circuit structure increases, conformal step coverage
becomes increasingly difficult to achieve. This report compares some
of the issues impacting users of different deposition tools, including:
APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD.
In addition., as device geometries shrink, semiconductor manufacturing has
become increasingly complex and precise, requiring a
better understanding of the specific processes involved. These issues are
described in the report.
This report discusses the technology trends, products, applications, and
suppliers of materials and equipment. It also gives insights to
suppliers for future user needs and should assist them in long range
planning, new product development and product improvement. A market
forecast for Thin Film Deposition Tools is presented to 2004.
TABLE OF CONTENTS
Chapter 1 Introduction
Chapter 2 Executive Summary
Chapter 3 Physical Vapor Deposition
- 3.1Introduction
- 3.2Sputtering Technology
- 3.3Plasma Technology
- 3.4Reactor Designs
- 3.4.1Long-Throw Deposition
- 3.4.2Collimated Sputter Deposition
- 3.4.3Showerhead Deposition
- 3.4.4Ionized PVD
- 3.5Semiconductor Processing
- 3.5.1Feature Patterning
- 3.5.2Gap Fill
- 3.6Targets
Chapter 4 Chemical Vapor Deposition
- 4.1Introduction
- 4.2Chemical Vapor Deposition (CVD) Techniques
- 4.2.1APCVD
- 4.2.2LPCVD
- 4.2.3PECVD
- 4.2.4HDPCVD
- 4.2.5ALD
Chapter 5 Electrochemical Deposition
- 5.1Introduction
- 5.2Reactor Design
- 5.3Challenges
- 5.4Additives
- 5.5Processing
- 5.5.1Superfilling
- 5.5.2Aspect Ratios
- 5.6Copper Cathodes
- 5.7Wet Copper Seed-Layer
Chapter 6 Film Deposition And Film Properties
- 6.1Introduction
- 6.2Dielectric Deposition
- 6.2.1Silicon Dioxide
- 6.2.1.1 Thermal CVD
- 6.2.1.2 PECVD
- 6.2.1.3 HDPCVD
- 6.2.2Silicon Nitride
- 6.2.2.1 Thermal CVD
- 6.2.2.2 PECVD
- 6.2.2.3 HDPCVD
- 6.2.3High-K Dielectrics
- 6.2.4Low-K Dielectrics
- 6.3Metal Deposition
- 6.3.1Aluminum
- 6.3.2Tungsten/Tungsten Silicide
- 6.3.3Titanium Nitride
Chapter 7 Vendor Issues
- 7.1Introduction
- 7.2300mm Processing
- 7.3Integrated Processing
- 7.4Copper
- 7.5Metrology
- 7.6ESD
- 7.7Parametric Test
Chapter 8 Market Forecast
- 8.1Introduction
- 8.2Key Issues
- 8.3Market Forecast Assumptions
- 8.4Market Forecast
- 8.4.1Chemical Vapor Deposition
- 8.4.2Physical Vapor Deposition
- 8.4.3Copper Electroplating Market
- 8.4.4Atomic Layer Deposition Market
FIGURES
- 3.1Schematic Of Sputtering System
- 3.2Magnetron Sputtering Design
- 3.3Showerhead Reactor Design
- 3.4Ionized PVD
- 4.1APCVD Reactor
- 4.2Tube CVD Reactor
- 4.3HDPCVD Reactor
- 4.4 ALD Versus PVD Copper Barrier
- 5.1Copper Electroplating System
- 8.1Worldwide MCVD Market Shares
- 8.2Worldwide DCVD Market Shares
- 8.3Worldwide DCVD Market By Sectors
- 8.4Worldwide HDHCVD Market Shares
- 8.5Worldwide PECVD Market Shares
- 8.6Worldwide SACVD Market Shares
- 8.7Worldwide LPCVD Market Shares
- 8.8Worldwide PVD Market Shares
- 8.9Worldwide ECD Market Shares
- 8.10ALD Applications a Share of Market
- 8.11Worldwide ALD Market Shares
TABLES
- 8.1Worldwide CVD Market Forecast
- 8.2Worldwide MCVD Market Shares
- 8.3Worldwide DCVD Market Shares
- 8.4Worldwide HDPCVD Market Shares
- 8.5Worldwide PECVD Market Shares
- 8.6Worldwide SACVD Market Shares
- 8.7Worldwide LPCVD Market Shares
- 8.8Worldwide PVD Market Forecast
- 8.9Worldwide PVD Market Shares
- 8.10Worldwide ECD Market Forecast
- 8.11Worldwide ALD Market Forecast
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