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SUMMARY
With UMTS mobile phones taking off in recent years, 3G chip suppliers have
adopted various strategies to develop this increasingly important market.
Besides TI and Qualcomm, other chip suppliers such as EMP, Freescale,
Infineon, Philips, and Agere are also starting to emerge as important players
in the 3G chip market. As construction of 3G systems is gradually completed,
chip makers' development in products and technology has become an increasingly
important issue. This report will examine the 3G chip solutions offered by the
leading suppliers.
TABLE OF CONTENTS
- Figure 1 2G and 3G Technology Development Timeline
- Figure 2 3G Mobile Phone Key IC Component Cost Structure
- Figure 3 3G Mobile Phone Baseband IC Integration Process
- Figure 4 Qualcomm MSM IC Development Timeline
- Figure 5 Qualcomm MSM6245 Chipset Architecture
- Figure 6 EMP U250 Chipset Architecture
- Figure 7 EMP WCDMA IC Development Timeline
- Figure 8 Infineon MP-EU Chipset Architecture
- Figure 9 Freescale i300-30 Chipset Architecture
- Figure 10 Philips Nexperia 7210 Chipset Architecture
- Figure 11 Broadcom Dual-core BCM2132+BCM2140 Chipset Architecture
- Figure 12 Agere Dual-Mode Sceptre HPU Chipset Architecture
- Figure 13 ADI SoftFone-W Chipset Architecture
- Table 1 Leading IC Suppliers' 3G Mobile Phone Solutions
- Table 2 Leading 3G IC Suppliers' Taiwanese Mobile Phone Clients
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