Nanotechnology in Wireless Handsets

SUMMARY

The wireless devices industry worldwide is driven by portability, miniaturization, power efficiency and consistent ROI, which are also its key desirable attributes. Nanotechnology principles, materials and techniques hold enormous potential towards realizing these attributes. The proposed report will investigate, analyze and forecast the shape of nanotechnology adoption in the wireless domains.

It explores thee following key aspects with respect to nanotechnology:

• Innovative push
• Business drivers and challenges
• Applications and devices
• Stakeholder categorization and strategies
• Adoption timelines and market sizes
• Impact on pricing

The report will present an all-round view of the gaps in current processes that nanotechnology will most effectively fill. It will also present the perspective of the major stakeholders and construct a matrix model of their activities and strategies. Importantly, it will systematically identify the timelines for its mainstream adoption in different applications and project its likely impact on the pricing of these devices and applications.

The applications and devices covered include the following among others:

• Batteries and fuel cells
• Electronically steerable antennas
• Displays
• Memory
• Chipsets
• Processors
• 15 nm node devices

The report will break down the results along to major geographical segments including North America, Europe, Middle East and Africa, Asia Pacific and Latin America.

TABLE OF CONTENTS

Chapter One: Executive Summary

Chapter Two: Introduction to Nanotechnology

• 2.1 Definition and Introduction
• 2.2 History of Nanotechnology
• 2.3 Drivers
  • 2.3.1 Portability
  • 2.3.2 Miniaturization
  • 2.3.3 Power Efficiency
  • 2.3.4 Consistent ROI
• 2.4 Limitations, Challenges and Constraints for Nanotechnology
• 2.5 Roleof MEMS as a Facilitator for Nanotechnology Adoption in Wireless Handsets
• 2.6 Areasof Focus
• 2.7 Conclusions

Chapter Three: Contemporary Manufacturing Process,Challenges and Innovations

• 3.1 Stepsin Manufacturing
  • 3.1.1 Design
  • 3.1.2 Fabrication
  • 3.1.3 Packaging and Assembly
  • 3.1.4 Testing
• 3.2 Overview of the Major Functions of Wireless Devices
• 3.3 Why is the Handset so Special?
• 3.4 CostAnalysis of Wireless Handset Components
• 3.5 Contemporary Architecture Scheme for the Wireless Handsets
• 3.6 Existing Technologies for Handset Components
  • 3.6.1 Antennas
  • 3.6.2 RFComponents
  • 3.6.3 Memory
  • 3.6.4 Processors
  • 3.6.5 Displays
  • 3.6.6 Batteries
• 3.7 Conclusions

Chapter 4: Nanotechnology and MEMS: Relevant Materials and Processes for Wireless Applications

• 4.1 Carbon Nano-Tubes (CNT)
  • 4.1.1 Introduction
  • 4.1.2 The Fullerene and Buckyball Family
  • 4.1.3 Methods of Synthesis
  • 4.1.4 CNT Alignments
  • 4.1.5 Characteristics, Features and Other Details
  • 4.1.6 Wireless Applications
    • 4.1.6.1 RF Component Applications
    • 4.1.6.2 Battery Applications
• 4.2 Spintronics
  • 4.2.1 Introduction
  • 4.2.2 Characteristics
  • 4.2.3 Features and innovations
  • 4.2.4 Wireless Applications
• 4.3 Quantum Dots
  • 4.3.1 Introduction
  • 4.3.2 Methods of Synthesis
  • 4.3.3 Characteristics
  • 4.3.4 Wireless Applications
    • 4.3.4.1 Quantum Dot LED (QD-LED)
    • 4.3.4.2 Non-Volatile Memory
    • 4.3.4.3 Computing Applications
• 4.4 MEMS value additions
  • 4.4.1 RFComponents
  • 4.4.2 Display
• 4.5 Conclusions

Chapter Five: Application of Nanotechnology in Wireless Applications and Devices

• 5.1 Antennas
  • 5.1.1 CNT Based Antennas
  • 5.1.2 MEMS Improvement Based Enhanced Antennas
• 5.2 RF Components
  • 5.2.1 FBAR Duplexers
  • 5.2.2 BAW Filters
• 5.3 Memory
  • 5.3.1 NRAM
  • 5.3.2 MRAM
  • 5.3.3 Molecular Memory
  • 5.3.4 Ovonic Memory
• 5.4 Processors
  • 5.4.1 CNT Based Processors
• 5.5 Batteries
  • 5.5.1 Fuel Cells
• 5.6 Displays
  • 5.6.1 OLED
  • 5.6.2 SED
• 5.7 Conclusions

Chapter Six: Stakeholder Analysis

• 6.1 Niche Experts
  • 6.1.1 Introduction and Features
  • 6.1.2 Case Studies
    • 6.1.2.1 Ambit Corporation
      • 6.1.2.1.1 Nanotechnology Initiatives
      • 6.1.2.1.2 Other Salient Details
      • 6.1.2.1.3 Analysis and Implications
    • 6.1.2.2 BatMax Corporation
      • 6.1.2.2.1 Nanotechnology Initiatives
      • 6.1.2.2.2 Other Salient Details
      • 6.1.2.2.3 Analysis and Implications
    • 6.1.2.3 Discera
      • 6.1.2.3.1 Nanotechnology Initiatives
      • 6.1.2.3.2 Other Salient Details
      • 6.1.2.3.3 Analysis and Implications
    • 6.1.2.4 Explay
      • 6.1.2.4.1 Nanotechnology Initiatives
      • 6.1.2.4.2 Other Salient Details
      • 6.1.2.4.3 Analysis and Implications
    • 6.1.2.5 Nanosys
      • 6.1.2.5.1 Nanotechnology Initiatives
      • 6.1.2.5.2 Other Salient Details
      • 6.1.2.5.3 Analysis and Implications
    • 6.1.2.6 Nantero
      • 6.1.2.6.1 Nanotechnology Initiatives
      • 6.1.2.6.2 Other Salient Details
      • 6.1.2.6.3 Analysis and Implications
    • 6.1.2.7 Poly Fuel
      • 6.2.1.7.1 Nanotechnology Initiatives
      • 6.1.2.7.2 Other Salient Details
      • 6.1.2.7.3 Analysis and Implications
    • 6.1.2.8 ZettaCore
      • 6.1.2.8.1 Nanotechnology Initiatives
      • 6.1.2.8.2 Other Salient Details
      • 6.1.2.8.3 Analysis and Implications
• 6.2 End Equipment Developers
  • 6.2.1 Introduction and Features
  • 6.2.2 Case Studies
    • 6.2.2.1 Motorola
      • 6.2.2.1.1 Nanotechnology Initiatives
      • 6.2.2.1.2 Other Salient Details
      • 6.2.2.1.3 Analysis and Implications
    • 6.2.2.2 Nokia
      • 6.2.2.2.1 Nanotechnology Initiatives
      • 6.2.2.2.2 Other Salient Details
      • 6.2.2.2.3 Analysis and Implications
• 6.3 Intermediate Component Specialists
  • 6.3.1 Introduction and Features
  • 6.3.2 Case Studies
    • 6.3.2.1 Avago Technologies
      • 6.3.2.1.1 Nanotechnology Initiatives
      • 6.3.2.1.2 Other Salient Details
      • 6.3.2.1.3 Analysis and Implications
    • 6.3.2.2 Freescale
      • 6.3.2.2.1 Nanotechnology Initiatives
      • 6.3.2.2.2 Other Salient Details
      • 6.3.2.2.3 Analysis and Implications
    • 6.3.2.3 IBM
      • 6.3.2.3.1 Nanotechnology Initiatives
      • 6.3.2.3.2 Other Salient Details
      • 6.3.2.3.3 Analysis and Implications
    • 6.3.2.4 Intel
      • 6.3.2.4.1 Nanotechnology Initiatives
      • 6.3.2.4.2 Other Salient Details
      • 6.3.2.4.3 Analysis and Implications
    • 6.3.2.5 Samsung
      • 6.3.2.5.1 Nanotechnology Initiatives
      • 6.3.2.5.2 Other Salient Details
      • 6.3.2.5.3 Analysis and Implications
    • 6.3.2.6 Sony Corporation
      • 6.3.2.6.1 Nanotechnology Initiatives
      • 6.3.2.6.2 Other Salient Details
      • 6.3.2.6.3 Analysis and Implications
• 6.4 Independent Research Institutes
  • 6.4.1 Introduction and Features
  • 6.4.2 Case Studies
    • 6.4.2.1 IMEC
      • 6.4.2.1.1 Nanotechnology Initiatives
      • 6.4.2.1.2 Other Salient Details
      • 6.4.2.1.3 Analysis and Implications
    • 6.4.2.2 Universities and Academic Institutes
• 6.5 Concept Developers
  • 6.5.1 Introduction and Features
  • 6.5.2 Case Studies
    • 6.5.2.1 ARM
      • 6.5.2.1.1 Nanotechnology Initiatives
      • 6.5.2.1.2 Other Salient Details
      • 6.5.2.1.3 Analysis and Implications
• 6.6 Conclusion

Chapter Seven: Quantitative Analysis and Forecasts

• 7.1 Description of Research Methodology
  • 7.1.1 Obtaining the Base Data for Wireless Handset Shipments
  • 7.1.2 Using the Base Data to Calculate the Market Size for Nanotechnology Enabled Components
  • 7.1.3 Pre-analysis Hypotheses for Regional Distribution
  • 7.1.4 Pre-Analysis Hypotheses for Pricing and Shipment Penetration Ratios
• 7.2 Individual Wireless Applications and Devices Analysis
  • 7.2.1 Antennas
    • 7.2.1.1 Market Size and Time-Frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.1.2 Regional Share
  • 7.2.2 RF components
    • 7.2.2.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.2.2 Regional Share
  • 7.2.3 Memory
    • 7.2.3.1 Market Size and Time-Frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.3.2 Regional Share
  • 7.2.4 Processors
    • 7.2.4.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.4.2 Regional Share
  • 7.2.5 Displays
    • 7.2.5.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.5.2 Regional Share
  • 7.2.6 Batteries
    • 7.2.6.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
    • 7.2.6.2 Regional Share
• 7.3 Conclusions

Chapter Eight: Epilogue

• Glossary: List of Acronyms

List of Exhibits

Chapter One: Executive Summary

• Exhibit 1.1: Individual Component Contribution Ranges for the Wireless Handset BoM
• Exhibit 1.2: Wireless Handset Enhancement Summary
• Exhibit 1.3: Timelines and Market Size for Nanotechnology Enabled Handset Components
• Exhibit 1.4: Timelines and Market Size for Nanotechnology Enabled Handset Components (table)
• Exhibit 1.5: Nanotechnology Enabled Wireless Handset Component Stakeholder Value Chain
• Exhibit 1.6: Benefit-ChallengeAnalysis for Nanotechnology Enabled Wireless Handset Components
• Exhibit 1.7: Stakeholder Classification and Activity Summary

Chapter Two: Introduction to Nanotechnology1

• Exhibit 2.1: Existing and Projected Advances in Semiconductor Manufacturing

Chapter Three: Contemporary Manufacturing Process, Challenges andInnovations

• Exhibit 3.1: CMOS GateSchematic
• Exhibit 3.2: 65 nm ProcessTransistor
• Exhibit 3.3: 45 nm Technology from AMD
• Exhibit 3.4: 32 nm Based SRAM TestChip from Intel
• Exhibit 3.5: Bottom View of a Chip with BGA7
• Exhibit 3.6: FC Bonding
• Exhibit 3.7: RF SiP
• Exhibit 3.8: PoP of Application Processor and DRAM
• Exhibit 3.9: Individual Component Contribution Ranges for the Wireless Handset BoM
• Exhibit 3.10: Functional Blocks of the Mobile Phone
• Exhibit 3.11: The Sky Cross EM-1800-1900 Mobile Phone Antenna Element Along with the Mobile Phone PCB
• Exhibit 3.12: Mobile PhoneStorage Memory
• Exhibit 3.13: SanDisk 1GB Micro SD
• Exhibit 3.14: The PXA300 Application Processor from Marvell
• Exhibit 3.15: The HTC Touch Phone with Interactive Display
• Exhibit 3.16: The Giorgio Armani Mobile Phone with a 2.6 Inch TFT LCD Screen
• Exhibit 3.17: Nokia B-4C Li-IonBattery
• Exhibit 3.18: Charging and Discharging of a Li-ion Battery

Chapter 4: Nanotechnology and MEMS: Relevant Materials and Processes for Wireless Applications

• Exhibit 4.1: Arrangement of Carbon Atoms in a Buckyball
• Exhibit 4.2: Block Diagram of CVD
• Exhibit 4.3: CNT Alignments
• Exhibit 4.4: Schematic Representation of CNT Alignments5
• Exhibit 4.5: Energy Saving Potential of Spintronics
• Exhibit 4.6: 20 nm Wide and 8 nmTall Quantum Dots
• Exhibit 4.7: Construction of aQD-LED
• Exhibit 4.8: A Schematic Representation of QC
• Exhibit 4.9: MEMS Capacitor Developed by Philips Used in RF Applications
• Exhibit 4.10: Summary ofApplications of Nanotechnology and MEMS in Wireless Handset Components

Chapter Five: Application of Nanotechnology in Wireless Applications and Devices

• Exhibit 5.1: Schematic Representation of FBAR
• Exhibit 5.2: Duplexers from Avago Aimed at PCS and WCDMA Technologies
• Exhibit 5.3: Block Diagram ofBAW Filter Used in a Quad-Band Transceiver from NXP
• Exhibit 5.4: Schematic of MRAM Read/Write Operations
• Exhibit 5.5: Cross Section of MRAM Developed by IBM
• Exhibit 5.6: STM Image of Highly Ordered Molecular Wire
• Exhibit 5.7: Schematic of FET Using CNT
• Exhibit 5.8: The Potential of CNT Induced Value Addition in Present Day Semiconductor Processes
• Exhibit 5.9: Chemical Reaction Driving the Fuel Cell
• Exhibit 5.10: OLED Layers
• Exhibit 5.11: MotoROKR U9 with OLED External Display
• Exhibit 5.12: The Sony Ericsson Seesaw Concept Phone with OLED Principal Display
• Exhibit 5.13: Wireless Handset Enhancement Summary
• Exhibit 5.14: Benefit-Challenge Analysis for Nanotechnology Enabled Wireless Handset Components

Chapter Six: Stakeholder Analysis

• Exhibit 6.1: Micro Porous Crystalline Solids
• Exhibit 6.2: Block Diagram of a Battery Powered by BatMax IonXR2
• Exhibit 6.3: BatMax Foils for Mobile Phones
• Exhibit 6.4: DisceraDisk-Wineglass Oscillator Used for RF Oscillator Functions
• Exhibit 6.5: The Explay Nano-Projector
• Exhibit 6.6: Block Diagram of Explay Nano-Projector Engine
• Exhibit 6.7: Schematic of NRAM
• Exhibit 6.8: NRAM Switching Circuitry
• Exhibit 6.9: Advantages of PolyFuel Membrane as Opposed to Fluorocarbon Membrane
• Exhibit 6.10: Components of the Molecular Memory Array Synthesized by Zetta Core
• Exhibit 6.11: Nanotubes in IC Fabrication
• Exhibit 6.12: Functional Block Diagram of ACMD-7601
• Exhibit 6.13: Block Diagram of MR2A16A
• Exhibit 6.14: Intra-Molecular Logic Performing Computer Circuit
• Exhibit 6.15: 64 Gigabyte Multi-Level Cell Flash Memory from Samsung
• Exhibit 6.16: IMEC Engagement Model
• Exhibit 6.17: ARM and Partner Interplay for Nokia N95 Handset Design
• Exhibit 6.18: Revenue Streams and Business Model of ARM
• Exhibit 6.19: ARM Cumulative Physical IP Licenses
• Exhibit 6.20: Nanotechnology Enabled Wireless Handset Component Stakeholder Value Chain
• Exhibit 6.21: Stakeholder Classification and Activity Summary

Chapter Seven: Quantitative Analysis and Forecasts1

• Exhibit 7.1: Methodology for Obtaining Base Data for Handset Shipments
• Exhibit 7.2: Methodology for Obtaining Market Size for Yet-to-Be-Launched Nanotechnology Enabled Wireless Handset Components
• Exhibit 7.3: Methodology for Obtaining Market Size of Commercially Available Nanotechnology-Enabled Wireless Handset Components
• Exhibit 7.4: Market for Nanotechnology Enabled Wireless Handset Antennas (2010-2012) (million)
• Exhibit 7.5: Regional Distribution of Nanotechnology Enabled Wireless Handset Antennas (2010-2012)(million)
• Exhibit 7.6: Regional Share of Nanotechnology Enabled Wireless Handset Antennas (2010-2012) (%)
• Exhibit 7.7: Market for Nanotechnology Enabled Wireless Handset RF Components (2007-2012) (million)
• Exhibit 7.8: Regional Distribution of Nanotechnology Enabled Wireless Handset RF Components (2007-2012)(million)
• Exhibit 7.9: Regional Share of Nanotechnology Enabled Wireless Handset RF Components (2007-2012) (%)
• Exhibit 7.10: Market for Nanotechnology Enabled Wireless Handset Memory (2009-2012) (million)
• Exhibit 7.11: Regional Distribution of Nanotechnology Enabled Wireless Handset Memory (2009-2012)(million)
• Exhibit 7.12: Regional Share of Nanotechnology Enabled Wireless Handset Memory (2009-2012) (%)
• Exhibit 7.13: Market for Nanotechnology Enabled Wireless Handset Processors (2010-2012) (million)
• Exhibit 7.14: Regional Distribution of Nanotechnology Enabled Wireless Handset Processors (2010-2012)(million)
• Exhibit 7.15: Regional Share of Nanotechnology Enabled Wireless Handset Processors (2010-2012) (%)
• Exhibit 7.16: Market for Nanotechnology Enabled Wireless Handset Displays (2007-2012) (million)
• Exhibit 7.17: Regional Distribution of Nanotechnology Enabled Wireless Handset Displays (2007-2012)(million)
• Exhibit 7.18: Regional Share of Nanotechnology Enabled Wireless Handset Displays (2007-2012) (%)
• Exhibit 7.19: Market for Nanotechnology Enabled Wireless Handset Batteries (2009-2012) (million)
• Exhibit 7.20: Regional Distribution of Nanotechnology Enabled Wireless Handset Batteries (2009-2012)(million)
• Exhibit 7.21: Regional Share of Nanotechnology Enabled Wireless Handset Batteries (2009-2012) (%)
• Exhibit 7.22: Timelines and Market size for Nanotechnology Enabled Handset Components