| Request a sample from "The Infoshop", another service of Global Information.
|
SUMMARY
A wireless industrial automation communications segment, at the present time,
presents a mixture of standardized and proprietary technologies whose goal is
to make SCADA, buildings, oil and gas and other industry to work efficiently
and provide high return on investment.
The segment is characterized by:
- Strict requirements on equipment environmental characteristics
- Requirement to support specification in the condition of severe
multi-fading
- Requirement of a battery life for several years (per node)
- Requirement to low latency
- Tendency to increase data rate and transmission range
- Requirement to support secure communications.
Currently, realizing that further advance is difficult without unified
industry efforts, there are several standard organizations that contribute to
the standardization process in this segment.
The report concentrates on new wireless technologies, which have been
standardized recently (or close to the standard finalizing).
They are:
- Ultra Wideband
- ZigBee, and
- 802.11n.
All these technologies support requirements outlined above. They are different
by structure, organization and properties, but intend to work effectively in
the wireless sensor mesh-topology structures, which industrial automation
defined preferable for communications.
The report researches these technologies specifics and markets with
applications for industrial automation communications. It shows that these
forward-looking technologies, despite their differences, may win significant
market share of the industrial wireless communications segment. It is
premature to judge which of them is in a leading position: so far, only ZigBee
showed commercial success in this segment. UWB allows extremely low
consumption and high-security communications; 802.11n significantly increases
distance and data rate.
The report goal is to show significance of these wireless technologies for
industrial automation. It is authors' opinion that they have abilities to win
this segment.
Target Audience
This report is important to a wide population of researches, technical and
sales staff involved in the developing of the IA communications services and
products. It is recommended for manufacturers, service providers and vendors
that are working with related technologies. The report also helps to
understand issues associated with relationship between IA communications and
other disciplines.
TABLE OF CONTENTS
1.0 Introduction
- 1.1 General
- 1.2 Value
- 1.3 Ethernet Proliferation
- 1.4 Goals
- 1.5 Research Methodology
- 1.6 Target Audience
2.0 Wireless IA Technology Features
- 2.1 Requirements
- 2.1.1Tasks
- 2.1.2 Wired vs. Wireless
- 2.2 Structures
- 2.2.1 Data Network Topologies
- 2.2.1.1 Point-to-point
- 2.2.1.2 Star
- 2.2.1.3 Mesh
- 2.2.1.3.1 Sensors and Mesh
- 2.2.1.3.2 Example
- 2.2.1.4 Comparison
- 2.3 Security Requirements
3.0 Standardization Process
5.0 Choices: Wireless Technologies
- 5.1 Ultra Wideband
- 5.1.1 General
- 5.1.2 Definition
- 5.1.3 Spectrum Allocation
- 5.1.4 Major Features
- 5.1.4.1 Communications Features
- 5.1.5 Standards and Regulations
- 5.1.5.1 Multiband OFDM
- 5.1.5.2 DS-UWB
- 5.1.5.3 Standards Bodies
- 5.1.5.4 Groups
- 5.1.5.4.1 Forces
- 5.1.6 Methods
- 5.1.7 UWB Vendors
- Aether (localization devices)
- Alereon (chipsets)
- Artimi (chipsets)
- BBN (radio, first responders)
- Camero (radar, equipment for first responders)
- decaWave (chipsets)
- Focus Enhancement (chipsets)
- Freescale (chipsets, systems)
- General Atomics (chipsets)
- Multispectral (RFID and others)
- Parco (RFID)
- Pulse~ Link (chipsets)
- Staccato (chipsets)
- TriQuint (chipsets - homeland security applications)
- Time Domain (chipsets-fusion of communications & radar)
- Tzero (chipsets)
- Ubisense (RFID-tracking)
- Wisair (chipsets)
- WiQuest (chipsets)
- 5.1.8 Market
- 5.1.8.1 General
- 5.1.8.2 Major Segments
- 5.1.8.3 Forecast
- 5.2 ZigBee
- 5.2.1 General
- 5.2.2 Device Types
- 5.2.3 Protocol Stack
- 5.2.3.1 Physical and MAC layers - IEEE802.15.4
- 5.2.3.1.1 Frame
- 5.2.3.2 Upper Layers
- 5.2.4 Interoperability
- 5.2.5 Security
- 5.2.6 Platform Considerations
- 5.2.6.1 Battery Life
- 5.2.7 Technology Benefits and Limitations
- 5.2.8 Standardization Process
- 5.2.9 ZigBee Vendors
- Airbee (Software)
- Amber (RF Systems)
- Atmel (Chipsets)
- Chipcon -TI (Chipsets)
- Cirronet (Modules)
- Crossbow(WSN, motes)
- Duolog (Transceivers)
- Eazix (Modules)
- Ember (Chipsets)
- Falcom (Modules)
- Helicomm (Modules)
- Jennic (Chipsets-Modules)
- Freescale (Chipsets)
- Luxoft Labs (Integration)
- M&R Lawugger GmbH (Software)
- Maxstream (WSN Modules)
- Moteiv(Modules, SW)
- Nanotron (Chipsets)
- Oki (Chipsets)
- Renesas (Platforms)
- Silicon Laboratories (Chipsets, Modules)
- Telegesis (Integrator)
- Ubiwave (Mesh Network)
- Uniband (Chipsets)
- ZMD (Chipsets)
- 5.2.10 Market
- 5.2.10.1 Expectations
- 5.2.10.2 Segments
- 5.2.10.3 Forecast
- 5.3 802.11n Technology
- 5.3.1 Advanced Technologies: MIMO and Others
- 5.3.1.1 General
- 5.3.1.2 Spatial Multiplexing
- 5.3.1.3 OFDM
- 5.3.2 Directions
- 5.3.3 Standard
- 5.3.4 Details: Technology
- 5.3.5 Benefits
- 5.3.6 802.11n Vendors
- Atheros
- Belkin
- Broadcom
- Intel
- Ruckus
- Linksys
- Marvell
- Metalink
- Netgear
- SiGe
- 5.3.7 Market
- 5.3.7.1 General
- 5.3.7.2 Market Forecast
- 5.3.7.2.1 Model Assumptions
- 5.3.7.2.1.1 Market Forecast
- 5.3.7.2.1.1.1 Chipsets
- 5.3.7.2.1.1.2 Equipment
6.0 WIA Market
- 6.1 Fragmentation
- 6.1.1 Geography
- 6.1.2 Protocols
- 6.1.3 Applications and Industries
- 6.2 Market Drivers
- 6.3 Forecast
7.0 IA Wireless: Vendors
- 3eTI (ZigBee)
- Aerocomm
- Cirronet
- Data-Linc
- DataRadio
- Digi
- Dust Networks
- MDS
- Moxa
- Omnex
- ProSoft
- RFM
- Socket
- Tendril
8.0 Conclusions
- Figure 1: Ethernet Channel: Simplified Structure
- Figure 2: Ethernet Signal Frame: Basic Structure
- Figure 3: Point-to-point Circuit
- Figure 4: Star Topology Illustration
- Figure 5: Illustration of Mesh Network
- Figure 6: UWB Spectrum
- Figure 7: Market Estimate: UWB Circuitry ($B)
- Figure 8: Market Estimate: Multiband OFDM UWB Circuitry ($B)
- Figure 9: Market Estimate: DS UWB Circuitry ($B)
- Figure 10: Estimate of UWB Market - Communications Applications ($B)
- Figure 11: ZigBee Protocol Stack
- Figure 12: Estimate: ZigBee Chipsets Market Worlwide ($M)
- Figure 13: ZigBee Market Segmentation (2006)
- Figure 14: ZigBee Market Segmentation (2010)
- Figure 15: MIMO Illustration
- Figure 16: 802.11 Protocol Family MAC Frame Structure
- Figure 17: 802.11n IC Market Estimate ($M)
- Figure 18: Market Estimate: 802.11n Equipment Shipping ($B)
- Figure 19: WIA Market Geography
- Figure 20: WIA Market Segmentation: Industries
- Figure 21: WIA Communications Market Estimate ($B)
- Table 1: Traditional 802.11 Family
- Table 2: Topologies Comparison
- Table 3: Comparison
- Table 4: UWB Market Segments
- Table 5: Frequency Bands
- Table 6: Rates
|
