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Emerging Trends in SMT Inspection and Testing

Product Type: Market Research Report Publication Date: Jun 30, 2006
 
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SUMMARY

This Frost & Sullivan research service entitled Emerging Trends in SMT Inspection and Testing provides an overview of the technological advances and trends in inspection and testing technology along with key drivers, challenges, restraints, and analysis of the same and long-term implications of the market factors affecting these industries. In this research, Frost & Sullivan's expert analysts thoroughly examine the following technologies: x-ray inspection (and related areas), different techniques to enhance optical inspection, intelligent software to help reduce inspection time, boundary scanning, design for testability (DFT), in-circuit testing, flying probe testing.

This analysis is available through our Technical Insights Growth Partnership Services program. With this program, clients receive industry-leading market research such as this, along with technical and econometric data and many interactive features including Analyst Inquiry Time and Client Councils.

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TABLE OF CONTENTS

1. Executive Summary

  • 1. Scope & Methodology
    • 1. Scope of the Research
    • 2. Research Methodology
  • 2. Key Findings
    • 1. Key Findings in the SMT Inspection Domain
    • 2. Key Findings in the SMT Testing Domain

2. Technology Primer and Adoption Factors

  • 1. Technology Primer
    • 1. SMT Assembly
    • 2. SMT Inspection
    • 3. SMT Testing
  • 2. Significant Technology Drivers
    • 1. SMT Inspection
    • 2. SMT Testing
    • 3. Technology Trends
  • 3. Significant Technology Challenges
    • 1. SMT Inspection
    • 2. SMT Testing

3. Impact Analysis of Emerging Trends in SMT Inspection

  • 1. Innovations in Optical Inspection
    • 1. Shadow Moiré--USA
    • 2. Vectoral Imaging--USA
    • 3. Embedded Process Verification--USA
    • 4. Optical Inspection of Solder Bumps--Israel
    • 5. Throughput Enhancement--Germany
  • 2. Innovations in X-ray-Based Inspection
    • 1. 3D X-ray Inspection--USA
    • 2. Off-Center Tomosynthesis--USA
    • 3. Versatile X-Ray Platform--Germany
    • 4. Fully Automatic X-ray Inspection--USA

4. Impact Analysis of Emerging Trends in SMT Testing

  • 1. In-Circuit and Functional Testing
    • 1. Stable and Robust ICT Testing--USA
    • 2. Advances in Flying Probe Tester--USA
  • 2. JTAG
    • 1. SystemBIST and JTAG Testing--USA
    • 2. Proof-of-Concept-System JTAG--USA
    • 3. SCANFLEX--Germany
    • 4. Design for Testability (DFT)--USA
    • 5. Accelerating Boundary Scan Application Development--Netherlands
    • 6. Integrating JTAG and Flying Probe Tester--Germany

5. Patents and Database of Key Industry Participants

  • 1. Patents and Glossary
    • 1. Patents on SMT Inspection
    • 2. Patents on SMT Testing
  • 2. Database of Key Industry Participants
    • 1. SMT Inspection Participants
    • 2. SMT Testing Participants

6. Frost & Sullivan 2006 Science & Technology Awards

  • 1. Technology Innovation Award
    • 1. Award Description
    • 2. Award Recipient
  • 2. Excellence in Technology Award
    • 1. Award Description
    • 2. Award Recipient
  • 3. Technology Leadership Award
    • 1. Award Description
    • 2. Award Recipient

7. Decision Support Database

  • 1. Database Tables
    • 1. Business PC Installed Base--World (1999 to 2006)
    • 2. Global Manufacturing Establishments--North America (1999 to 2009)
    • 3. Global PC Installed Base--World (1999-2006)
    • 4. Electronic Components Contribution to Electronics Industry--World (1999 to 2006)
    • 5. Medical and Industrial Contribution to Electronics Industry--World (1999 to 2006)

Emerging Trends in SMT Inspection and Testing

Publisher: Technical Insights, Inc.

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