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Emerging Trends in SOI Technology

Product Type: Market Research Report Publication Date: Sep 29, 2006
 
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SUMMARY

Research Overview

This Frost & Sullivan research service titled Emerging Trends in SOI Technology provides analyses of complementary metal-oxide-semiconductor (CMOS)-SOI, novel SOI devices, SOI-MEMS, capacitorless memory, micro-opto-electro-mechanical-system (MOEMS), III-V compound materials-on-insulator and others. It also includes key drivers, challenges, restraints, analysis and forecasts of the technologies may shape the of future semiconductor testing industry. In this study, Frost & Sullivan's expert analysts thoroughly examine the following markets: semiconductor devices and semiconductor manufacturing.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

  • Scope and Research Methodology
    • Scope
    • Research Methodology
  • Introduction and Key Findings
    • Introduction
    • Key Findings

2 PRIMERS ON SOI TECHNOLOGY AND ITS APPLICATIONS

  • Introducing SOI Technology
    • Why Do We Need SOI?
    • Explaining SOI
    • Types of Thin Film SOI Wafers
    • Techniques Used for Fabricating Thin-Film SOI Wafers
  • Applications
    • Existing Applications
    • Emerging Applications

3 RECENT DEVELOPMENTS

  • Industry
    • Zero Capacitor RAM-Innovative Silicon
    • World's Thinnest RFID Chip-Hitachi
    • SOI Technology Enhances In-Vehicle Networking Performance-Philips Semiconductor
    • ITFET and sSOI technologies on SOI Wafers-Freescale Semiconductor
    • Fastest SOI Bipolar Devices for High-Speed Analog (HSA) Applications-Zarlink
    • Capacitorless Twin-Transistor RAM-Renesas
    • Ultralow Off-State Leakage Transistor-Oki Electric
    • Thick SOI for MEMS Applications-Tronic Microsystems and ELA Medical
    • High-Speed ADC with Ultralow Noise-Analog Device
    • First SOI-Based ASIC Devices-Soisic
    • First Demonstration of Capacitorless DRAM-Toshiba
    • European Partnership to Develop High-Performance SOI IC-SilOnIS
    • Development of 300 mm sSOI Wafer-Soitec and ASM
    • 65 nm SOI Technology with Enhanced Transistor Strain-IBM + AMD + Sony + Toshiba
  • Academia
    • Transition from Wire Formation to Island Formation on SOI Wafer-Shizuoka University (Japan)
    • Silicon-on-Diamond for Future Electronic Applications-North Carolina State University (US)
    • Silicon-Carbon Source/Drain Devices-National University of Singapore (Singapore)
    • Sensors and Actuators Based on SOI Materials-Chalmers University of Technology (Sweden)
    • Large Grain Polysilicon-On-Insulator with High Temperature Sensing Capability-Hong Kong University (Hong Kong)
    • InP on Insulator Substrate-Institute of Materials Research and Engineering (Singapore)

4 ADOPTION FACTORS AND FORECASTS

  • Driving Factors
    • AMD's Success
    • Improvement in Cost and Supply of SOI Wafers
    • Bottleneck in Scaling and Soft-Error Radiation Problem in Memory Devices
    • The Push for Strained Silicon
    • III-V Materials-on-Insulator Technology
    • SOI MEMS Applications and Nanodevices
  • Constraints and Challenges of SOI
    • Floating Body Potential Effect
    • Effects on CMOS Process
    • High Cost and Supply of SOI Wafers
    • Design SOI IPs
  • SOI's Future
    • Supporting Novel Devices
    • Complementing Strain Technology
    • SOI MEMS

5 KEY CONTACTS AND SELECTED PATENTS

  • Key Contacts
    • Corporates
    • Universities and Institutes
  • Selected Patents
    • Patents I
    • Patents II

6 DECISION SUPPORT DATABASE

  • Semiconductor Applications Statistics--World
    • Business PC Installed Base (1999-2006)
    • PC Installed Base (1999-2006)
    • Educational PC Installed Base (1999-2006)
    • Laptops Installed Base (1999-2006)
    • Portable PC Install Base (1999-2006)
    • Consumer Electronic Contribution to Electronics Industry (1999-2006)
    • Control and Instrumentation Contribution to Electronics Industry (1999-2006)
    • Electronic Components Contribution to Electronics Industry (1999-2006)
    • Medical and Industrial Contribution to Electronics Industry (1999-2006)
    • Office Equipment Contribution to Electronics Industry (1999-2006)
    • Radio Communication and RADAR Contribution to Electronics Industry (1999-2006)
    • Telecommunication Contribution to Electronics Industry (1999-2006)
  • Semiconductor Industry Statistics
    • Global Semiconductor and Semiconductor Equipment Market (1999-2006)
    • Number of Semiconductor Plants-USA (1988-2001)

Emerging Trends in SOI Technology

Publisher: Technical Insights, Inc.

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Web Access (Regional License) US $6000.00
Web Access (Regional License) & Hard Copy US $6500.00
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